MagnaBond OxAlt is a three-part microetch additive said to promote mechanical copper-epoxy bonding by optimizing the copper substrate topography.
Reportedly yields a consistent, high-topography, acid-stable copper surface, ensuring optimum copper-dielectric adhesion. Is suitable for use with a variety of printed circuit board dielectrics, including FR-4, BT and polyimide. Etches at rates of 40 microinches per minute.
RBP Chemical Technology, www.rbpchemical.com