MagnaBond OxAlt is a three-part microetch additive said to promote mechanical copper-epoxy bonding by optimizing the copper substrate topography.

Reportedly yields a consistent, high-topography, acid-stable copper surface, ensuring optimum copper-dielectric adhesion. Is suitable for use with a variety of printed circuit board dielectrics, including FR-4, BT and polyimide. Etches at rates of 40 microinches per minute.

 

RBP Chemical Technology, www.rbpchemical.com

 

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