Log in / Register
Account Login
Register
  • Forgot Username?
  • Forgot Password?
  • Material Selection for High-Speed PCBs

    Material Selection for High-Speed PCBs

    Consider return loss and insertion loss – but don’t stop there.  READ MORE...

  • Characterizing Etchback and Dielectric Loss Tangent

    Characterizing Etchback and Dielectric Loss Tangent

    Fabrication-aware simulations to aid PCB design success.  READ MORE...

  • Sequential Lamination in PCB Manufacturing

    Sequential Lamination in PCB Manufacturing

    Manufacturing high-layer count boards.  READ MORE...

  • Implementing Flash Memory in PCB Design

    Implementing Flash Memory in PCB Design

    Routing flash has EMI implications.   READ MORE...

Homepage Slideshow

  • Material Selection for High-Speed PCBs

    Consider return loss and insertion loss – but don’t stop there.

    https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18654-what-is-the-best-material-for-a-high-speed-pcb

  • Characterizing Etchback and Dielectric Loss Tangent

    Fabrication-aware simulations to aid PCB design success.

    https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18652-characterizing-etchback-and-dielectric-loss-tangent

  • Sequential Lamination in PCB Manufacturing

    Manufacturing high-layer count boards.

    https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18653-sequential-lamination-in-pcb-manufacturing

  • Implementing Flash Memory in PCB Design

    Routing flash has EMI implications. 

    https://www.pcdandf.com/pcdesign/index.php/current-issue/241-designer-s-notebook/18648-implementing-flash-memory-in-pcb-design

Tweets by @FrancesStewart5
Printed Circuit Design & Fab Magazine
  • HOME
  • Advertising
    • Sales Contacts
    • Media Kit
  • .
  • Education
    • Archives
    • News
      • Design News
      • Fab News
      • Market News
    • New Products
    • Features
    • The Route: Printed Circuit Engineering Association News
    • Editorial Contributions
    • NPI Award
    • CIRCUITS ASSEMBLY Magazine
    • White Papers/e-Books
    • Hall of Fame
    • Printed Circuit University
  • Research
    • Market Data
    • NTI-100
    • PCB Design History
    • CAD/CAM/PCB Software Providers
    • PCB Design Engineer Salary Surveys
  • .
  • PCB Update
  • .
  • Events
    • PCB West
    • Industry Events
    • PCB2Day Workshop Series
    • PCB East
  • .
  • Subscribe
  • .
  • Search
  • Home
  • Education
  • New Products
  • Neoconix Debuts SPH1 Compression Connectors

Neoconix Debuts SPH1 Compression Connectors

Published: 31 January 2012

SPH1 family of compression connector products for flex-to-board and board-to-board applications combine high density and reliability with electrical performance. Come in area-array styles at 0.8mm, 1.0mm and 1.27mm pitch, with pin counts ranging from 80 to 120 positions. Interposer thicknesses range from 0.5mm to 3.0mm fully mated. RoHS 2002/95/EC compliant.

Neoconix, www.neoconix.com

  • Prev
  • Next
Submit to FacebookSubmit to Google PlusSubmit to TwitterSubmit to LinkedInPrint Article
MAY ISSUE
May cover

View the Digital
Edition Here!

POPULAR

  • The Dynamics of PCB Trace Heating and Cooling, and a Call to Action
  • What is the Best Material for a High-Speed PCB?
  • Characterizing Etchback and Dielectric Loss Tangent
  • Sequential Lamination in PCB Manufacturing
  • Are You Using Too Many Vias?

Press Releases

  • TTM Technologies, Inc. Announces Retirement of Founder and Board Member, Kent Alder
  • Global Leader in Thermal Management Laird Thermal Systems Unveils New Identity; Max Kley and Christoph Bauckhage Comment
  • ASC Sunstone Circuits and Screaming Circuits Partner to Launch Online Assembly Parts Ordering – A New Step Toward Seamless PCB Production
  • ECIA Launches Webinar Series ‘Are Date Code Restrictions Still Relevant’; Don Elario, Dan Deisz, and Eric Miscoll Comment
  • News
  • .
  • Products
  • .
  • Contacts
  • .
  • PCB Chat
  • .
  • Login

ISSN 1555-7936, Copyright © 2024 Printed Circuit Engineering Association®, PO Box 807 Amesbury MA 01913. All rights reserved. This website contains copyrighted material that cannot be reproduced without permission. Printed Circuit Engineering Association® Privacy Policy