Stackup Planner for Altium Designer is a bidirectional interface that imports the substrate configuration from ICD Stackup Planner and automatically creates corresponding layers in Altium Designer, configuring the Layer Stackup Manager.

Microwave Studio v. 2012 comes with 3D planar electromagnetic multilayer solver for planar modeling and analysis. Is based on Method of Moments; reportedly accurately simulates multilayer geometries. Features automatic layer stack generation from 3D models, open boundaries, automatic edge mesh refinement, and automatic de-embedding of ports. Typical applications are RF designs such as planar antennas and filters, as well as MMIC and planar feeding network designs. With System Assembly and Modeling module, simulates planar components of complex systems more efficiently.

Computer Simulation Technology, www.cst.com

Studio Suite v. 2012 System Assembly and Modeling module provides an environment that simplifies simulation project management. Compares results of different solvers or model configurations within one simulation project. A linked sequence of solver runs can be initiated. All simulations and links can be defined to enable, for example, a seamless multiphysics work flow. Can be used to set up 3D systems built of various components. Simulation tasks can be defined that include single or multiple components; can specify which components should be simulated in 3D, and which should be represented by S-parameters or an equivalent field source. Can create and simulate system in full 3D.

Computer Simulation Technology, www.cst.com

EMPro 2011.11 3D modeling and simulation platform, for creating 3D models and analyze electrical performance of packages, connectors, antennas and other RF components, introduces key improvements to the FEM simulator: