Concerto v7.5R1 electromagnetic design software for RF and microwave applications includes enhancements that center on 3D geometric modeler. Has meshing options for the finite element Eigenvalue solver. Modeler now has additional features in finite difference time domain simulation engine, including the ability to present frequency domain field plots over any regions of the model, and for any number of frequencies, from a single time domain analysis. Now supports features for the simulation of complex materials in FDTD. Defines lumped ports with frequency dispersive properties, based on Drude, Debye and Lorentz models, providing a circuit element representation of discrete structures within complex materials. New tool enables swept far-field results to be generated by the FDTD solver in arbitrary directions. Concerto Manager now features tabbed folder windows, with an enhanced capability for running frequency domain solvers in batch mode. Extends the range of commands and features in the scripting language, and provides a redesigned editor for creating and editing command files. Provides FDTD simulator as standard. Offers a finite element method analysis module for characterizing performance of devices such as RF cavities and microwave resonators.

Cobham Technical Services, www.cobham.com

T2B software for transistor to behavioral model conversion is said to be accurate, fast, globally supported, and practical for on-chip and packaged I/O circuits. For analyzing combined signal and power integrity effects in high-speed designs such as those that include DDR parallel bus interfaces. Models retain transistor-level accuracy while enabling dramatically improved simulation efficiency. Enable accurate full bus simulations to be completed in hours or minutes, while similar simulations with transistor models often take days. Converts transistor level models to IBIS 5.0 power-aware models that retain accuracy of the original, enabling support of full bus simulation flow for quick design improvements. Automatically generates IBIS 3.2, 4.2, 5.0 and Sigrity accuracy-enhanced models from transistor level driver models. Improve accuracy when used with HSPICE and other transient simulators.

Sigrity, www.sigrity.com

891 and 893 64-position, 1mm pitch mezzanine connectors are for parallel board stacking interconnections. Surface mount connectors have a mated height of 10mm. Provide high-density packaging. Locating posts are incorporated into housing to promote accurate placement on the PCB. Are RoHS compliant and suitable for Pb-free reflow soldering processes. Packaging is tape and reel, per EIA-783 (56mm wide; 16mm pitch). Feature 30u" gold-plated contacts. Insulator housings are made of high-temperature glass-filled LCP, rated UL 94 V-0.  Meet EIA-700 AAAB specifications for IEEE 1386 applications. This standard can be found on VME, VME64 and VME64X boards, CompactPCI boards, Multibus I and II boards, desktop and portable computers and servers; can also be used as modular connectors for front panel and backplane I/O cards.

Mill-Max, www.mill-max.com/PR623

F05 Poly-forms are an alternative to liquid adhesives for component assembly. Are flexible pre-shaped adhesives designed for bonding metals, plastics, and glass. Have negligible vertical flow; keep adhesive contained in precisely defined areas. Pre-shaped copolymer prevents drips and dispensing inconsistencies typical of liquid adhesives. Adhesive placement is consistent from bond to bond. Facilitates manual and automated handling. Can be pre-shaped in multiform configurations to accommodate a broad range of applications. Temperature and time required to process depend on component materials, design, bond requirements, and operating environment. Adding pressure and increasing oven temperature and time improves adhesion. Min. processing temperature is 107°C. Typical processing schedule is 135°C for 10 min. under 5 psi.

Multi-Seals, www.multi-seals.com