GenClad 280 is a woven fiberglass-reinforced composite material engineered for efficiency in multilayer RF and high-frequency printed circuit boards. Combines a non-polar thermoset resin system with a controlled expansion ceramic filler and a low-loss thermoplastic material. Is halogen-free. Is a low loss ceramic-filled thermoset/thermoplastic hybrid system. Matches PTFE laminate electrical performance.

Arlon, www.arlon-med.com

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