VHF 300 VS horizontal selective via hole filler with vacuum is designed for printed circuit board selective via hole filling, through holes and blind vias. PCB and stencil are placed horizontally onto the filling surface and clamped. Plunger (air pressure controlled) presses paste through stencil into the holes of panel. Paste is stored in reusable cartridges. Different heads are supplied for different panel sizes. Movement of Y-axis is controlled by servo motor. Touch panel display allows up to 50 recipes to be stored. Paste delivery is from a 12 oz, 6 oz, or smaller cartridge. Paste is pressed into the via fill head via pneumatic pressure on the back of the plunger in the cartridge. Pastes used are silver and copper paste (conductive) and epoxy fill (non-conductive).  Max panel size is 24" x 30".

MASS, www.mass-pcb.de

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