SinkPAD aluminum printed circuit board technology reportedly improves LED thermal management. Is effective in high-power LED cooling. Conducts heat from the LED by enabling a direct thermal path between the LED and surrounding atmosphere. LED thermal resistance can be reduced by eliminating the lowest thermal conductivity/highest thermal resistance component, the dielectric material. Dielectric material functions only as an electrically insulated barrier to the metal base, but leaves it thermally connected.

SinkPAD, www.sinkpad.com

SystemSI signal integrity analysis software is for end-to-end simulations of high-speed signal interfaces. Has block-based editor, support for standard modeling formats, automated model connections and accurate simulation. Can be used at the pre-layout stage, post-layout stage, or anywhere in between. TLine Editor and Via Wizard are available. Model connections are automated with open Model Connection Protocol format. Is available in SystemSI – Serial Link Analysis and SystemSI – Parallel Bus Analysis. The latter builds on capabilities introduced in Channel Designer software to analyze high-speed SerDes designs. Parallel Bus Analysis brings the same level of automation and accuracy to the design of high-speed bus interfaces such as DDRx memory interfaces; enables quick analysis of timing margins for DDRx memory interfaces; considers multiple effects concurrently, including dielectric/conductor loss, reflections, crosstalk, inter-symbol interference and simultaneous switching noise.

Sigrity, www.sigrity.com

GenClad 280 bond-ply is a woven fiberglass-reinforced, ceramic-filled composite material for multilayer RF and high-frequency printed circuit boards. Combines a non-polar thermoset resin system with controlled-expansion ceramic filler and a low-loss thermoplastic material. Is engineered for use in bonding dissimilar and hard-to-bond materials in multilayer PCB structures, particularly in high-speed and microwave applications. Is compatible with PTFE laminate materials; prepreg processes in conventional FR-4 lamination cycles. Has a low dielectric constant and loss (2.8/0.002 at 10 GHz); low water absorption (0.04%); stable dielectric constant over frequency and temperature; excellent adhesion to a variety of PTFE and other RF/microwave cores; high decomposition temperature (443°C) and T288 (>60 sec) for Pb-free solder compatibility; low Z-direction CTE (45-50 ppm/°C) for enhanced PTH reliability, and is RoHS compliant.

Arlon Material for Electronics, www.arlon-med.com 

Si9000e transmission line field solver now adds surface-modeling of both sides of copper printed circuit board layers into insertion-loss calculations. Models matte and drum surfaces of copper layers. Is compatible with Polar Speedstack layer stackup design tool. Can import material Er and Tan delta over multiple frequencies. Boundary-element method field solver models more than 100 PCB transmission line structures. Predicts impedance, attenuation, RLGC, and S-parameters with frequencies ranging from a few kHz up to the point where the line ceases to operate in TEM mode, typically around 100GHz. Can explore “what if” scenarios for rapid simulation of the impact of different materials and geometries. Can document complex stackups in minutes. Can be used in pre-layout design, reference chipset stackup design and post-layout modeling of impedance and insertion loss.

Polar Instruments, www.polarinstruments.com