Tac-LED-3D is an IMS substrate based on ceramic-filled fluorpolymer thermoplastic resin chemistry. Has ultra-thin, nonbrittle dielectric (0.085mm) and high copper peel strength; is SMT compatible; 3D structures can be formed after SMT assembly; has high thermal conductivity and high resistance to thermal aging. Applications include LED lighting and high-power LED PCBs. Is robust with adhesion to metal layers. Melt temperature is in excess of 300℃. Aluminium and copper backings are available.

Taconic, www.taconic-add.com 

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