Aurolectroless SMT 520 ImAu finish reportedly permits operation at low gold salt concentrations to reduce gold consumption in ENIG processes. Is said to provides deposit coverage to increase corrosion resistance during subsequent process steps.

Dow Electronics Materials, www.dow.com

LCP Laminates are adhesiveless and film-based, for semiconductor packages and coreless designs up to 6 layers as well as in combination with other rigid materials as hybrid circuits. Start with Rogers Ultralam 3000 materials, for low dielectric constant and dissipation factor for RF designs. Tolerate high levels of radiation exposure

Endicott Interconnect Technologies, www.eitny.com

Fabric Shielding Gasket line includes more than 125 profiles and sizes.

FAB 3000 v.5 CAM software runs DRC/DfM verification, edits and outputs Gerber data, compares nets, merges PCBs, and generates part centroid files.