SystemSI signal integrity analysis software is for end-to-end simulations of high-speed signal interfaces. Has block-based editor, support for standard modeling formats, automated model connections and accurate simulation. Can be used at the pre-layout stage, post-layout stage, or anywhere in between. TLine Editor and Via Wizard are available. Model connections are automated with open Model Connection Protocol format. Is available in SystemSI – Serial Link Analysis and SystemSI – Parallel Bus Analysis. The latter builds on capabilities introduced in Channel Designer software to analyze high-speed SerDes designs. Parallel Bus Analysis brings the same level of automation and accuracy to the design of high-speed bus interfaces such as DDRx memory interfaces; enables quick analysis of timing margins for DDRx memory interfaces; considers multiple effects concurrently, including dielectric/conductor loss, reflections, crosstalk, inter-symbol interference and simultaneous switching noise.

Sigrity, www.sigrity.com

GenClad 280 bond-ply is a woven fiberglass-reinforced, ceramic-filled composite material for multilayer RF and high-frequency printed circuit boards. Combines a non-polar thermoset resin system with controlled-expansion ceramic filler and a low-loss thermoplastic material. Is engineered for use in bonding dissimilar and hard-to-bond materials in multilayer PCB structures, particularly in high-speed and microwave applications. Is compatible with PTFE laminate materials; prepreg processes in conventional FR-4 lamination cycles. Has a low dielectric constant and loss (2.8/0.002 at 10 GHz); low water absorption (0.04%); stable dielectric constant over frequency and temperature; excellent adhesion to a variety of PTFE and other RF/microwave cores; high decomposition temperature (443°C) and T288 (>60 sec) for Pb-free solder compatibility; low Z-direction CTE (45-50 ppm/°C) for enhanced PTH reliability, and is RoHS compliant.

Arlon Material for Electronics, www.arlon-med.com 

Si9000e transmission line field solver now adds surface-modeling of both sides of copper printed circuit board layers into insertion-loss calculations. Models matte and drum surfaces of copper layers. Is compatible with Polar Speedstack layer stackup design tool. Can import material Er and Tan delta over multiple frequencies. Boundary-element method field solver models more than 100 PCB transmission line structures. Predicts impedance, attenuation, RLGC, and S-parameters with frequencies ranging from a few kHz up to the point where the line ceases to operate in TEM mode, typically around 100GHz. Can explore “what if” scenarios for rapid simulation of the impact of different materials and geometries. Can document complex stackups in minutes. Can be used in pre-layout design, reference chipset stackup design and post-layout modeling of impedance and insertion loss.

Polar Instruments, www.polarinstruments.com

DF59 2mm pitch connector provides wire-to-board, board-to-board joint and short-circuit sockets in a single connector design. Is ideal for LEDs and applications that require a small connector. Has a swing lock that uses positive and friction locks, giving wire-to-board type connections cable pull force resistance. Cable end is mated at a slight angle; other end of the plug is pushed down to complete mating with an audible click. Provides stress-free contact for 0.5mm floating function in XYZ directions. Has a height of 2.5mm and overall size of 8 x 9mm. Has a 2mm pitch and is available in 2, 3 and 4 positions. Has a high current capacity of 3A (with AWG 22 cable) and a high contact lance strength for wire-to-board type connections. Is RoHS-compliant.

Hirose Electric Co., www.hiroseusa.com