Printed Circuit Design & Fab Online Magazine - New Products

New Products

SinkPAD technology for aluminum IMS PCB improves LED thermal management; is for high-power and high-bright surface mount LED systems that can't efficiently dissipate heat. Conducts heat from LED system by enabling a direct thermal path between the LED and surrounding atmosphere; eliminates thermal resistance introduced by dielectric material in a traditional IMS PCB or MCPCB. Reportedly removes the substance with the lowest thermal conductivity/highest thermal resistance from the structure. Isolates dielectric’s metal base electrically and leaves it thermally connected.

SinkPAD, www.sinkpad.com

3D EXT analysis tool is reportedly capable of full wave parasitic extraction of hundreds or thousands of interconnects simultaneously. Supports all types of interconnects, including wire bond, column grid and via arrays, and through silicon vias (TSVs) used in ICs and silicon interposers. Output is standard Touchstone file or RLGC information that can be directly input to Sphinx for Signoff for frequency simulation or converted to Spice with Idem Plus for simulation in any customer preferred spice timing based simulator.

E-System Design, www.e-systemdesign.com

Sphinx for Signoff 64-bit software is a signal and power integrity co-simulator for IC packaging and PCB design. Uses M-FDM methodology. Analyzes complex designs prior to release to production and final signoff for manufacturing. Features include support for DXF, MCM, BRD and SiP file formats; performs quick “what-if analysis” by permitting modification to existing designs; adds capacitor vendors’ libraries; views meshed design before simulation; offers scripting; performs time domain analysis with an integrated flow using Touchstone files converted into robust, passivity and causality conforming spice netlists using IdEM Plus, and incorporates Spice models of complete packages and PCBs for system-level analysis.

E-System Design Inc., www.e-systemdesign.com

3D Forming FPC is a three-dimensional flexible substrate consisting of thermoplastic liquid crystal polymer and copper foil. Withstands reflow temperatures up to 260°C, and has thermal conductivity of 0.5W/m·K, water absorption rate of less than 0.04%, and and dielectric loss tangent of 0.0025.

Nippon Mektron, www.mektron.com

ELpF lightweight benchtop vibration isolation system can be repositioned, even with a load and in float. Does not damage vibration isolators. Provides vibration isolation for sensitive devices. Features a load capacity of 100 or 300 lbs. Has a 3" high nominal profile; uses a 16" x 19" standard tabletop, and weighs 40 lbs. Features include gauges tilted upward and recessed handles. For supporting atomic force microscopes, microhardness testers, analytical balances, and other gear in laboratories and Class 100 cleanrooms. Self-leveling and active-air isolation give the platform natural frequencies of 1.75 Hz vertical, 2.0 Hz horizontal, and typical isolation efficiencies of 95% (vertical) and 92% (horizontal) at 10 Hz.

Kinetic Systems Inc., www.kineticsystems.com

XFE (Crosshatch Flex Enhancement) technique couples novel 2-D field solvers with a unique algorithm to correct for the effects of flex over a range of typical controlled impedance structures. Enables solvers to more closely model the effects of a wide variety of crosshatch geometries. Permits configuration of hatch pitch (HP) and width (HW). Reduces prototype turns when producing impedance controlled flex PCBs. Models controlled impedance lines with crosshatch or mesh ground returns. Is said to be for any PCB type deploying meshed/cross-hatched return planes (e.g., interposers). Is for Si8000 and Si9000 field solvers.

Polar Instruments, polarinstruments.com