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  • Optimizing Mixed Signal Circuit Designs

    Optimizing Mixed Signal Circuit Designs

    Navigating the analog and digital worlds.  READ MORE...

  • Developing Organizational Culture for Troubleshooting

    Developing Organizational Culture for Troubleshooting

    Solving problems and adding value.  READ MORE...

  • Cloud Collaboration

    Cloud Collaboration

    Real-time breakdowns cost more than you think.  READ MORE...

  • The Experts' Take on AI

    The Experts' Take on AI

    What’s working now and what’s not (but should be).
      READ MORE...

  • Designing for High-Pin Count Devices

    Designing for High-Pin Count Devices

    Overcoming “anywhere but here.”  READ MORE...

  • Bluetooth Design

    Bluetooth Design

    6 steps for limiting interference and data loss.  READ MORE...

Homepage Slideshow

  • Optimizing Mixed Signal Circuit Designs

    Navigating the analog and digital worlds.

    https://www.pcdandf.com/pcdesign/index.php/current-issue/241-designer-s-notebook/18794-optimizing-mixed-signal-circuit-designs

  • Developing Organizational Culture for Troubleshooting

    Solving problems and adding value.

    https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18798-developing-organizational-culture-for-troubleshooting

  • Cloud Collaboration

    Real-time breakdowns cost more than you think.

    https://www.pcdandf.com/pcdesign/index.php/current-issue/289-best-practices/18796-cloud-collaboration-avoiding-pcb-design-chaos

  • The Experts' Take on AI

    What’s working now and what’s not (but should be).


    https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18760-ai-in-electronics-manufacturing-what-s-working-now-what-s-not-but-should-be

  • Designing for High-Pin Count Devices

    Overcoming “anywhere but here.”

    https://www.pcdandf.com/pcdesign/index.php/current-issue/241-designer-s-notebook/18755-designing-for-high-pin-count-devices

  • Bluetooth Design

    6 steps for limiting interference and data loss.

    https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18758-bluetooth-circuit-board-design-guidelines

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  • Dow Debuts Advanced SAP Metallization Chemistry

Dow Debuts Advanced SAP Metallization Chemistry

Published: 03 November 2010

Advanced SAP Metallization semi-additive process chemistry includes neutralizer, conditioner and electroless copper. Provides high dielectric adhesion with low roughness, plating coverage on both via bottom and surface, excellent bath stability and reliability performance for ultra fine lines.

Dow Electronic Materials, www.dow.com

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