New Products

IsoStack free software tool is for PCB stackup design. Saves design files locally or shares via email in standard formats. Includes up-to-date database of globally available constructions and electrical data on high-speed digital Isola materials. Built-in pressed thickness calculator offers automatic design checks for hybrid builds and warnings for insufficient prepreg and glass stop. Features equation-based calculators for targeting desired impedance. Is available online in beta version.

Isola, www.isola-group.com/isodesign/

Fusion3D laser, for laser-direct structuring, has upgraded revised optics and laser control. Reportedly cuts structuring times for 3D circuit boards 10% to 20%, depending on component layout. Includes improvements on laser head.

LPKF Laser & Electronics AG, http://www.lpkfusa.com/images/fusion3d

Cable Studio and Microwave Studio TLM solver are integrated in Studio Suite 2011. Is a single unified environment for all EMC-related modeling tasks, including simplified model setup and simulation. MWS TLM solver (Microstripes) and CS provide features for real-world EMC analysis, including coupled simulations that enable large system analysis and installed performance studies. In preprocessing, performs definition of compact equivalent aperture models and cable harnesses. Enhances coupling between the electromagnetic field and cable solvers to enable direct transient simulation of susceptibility problems in systems containing complex cable bundles, including shielded twisted pair circuits.

Computer Simulation Technology, www.cst.com

RO4460 prepreg coupled with RO4360 laminate is said to feature a dielectric constant of 6.15 ±0.15 and dielectric loss of 0.003 at 2.5 GHz.

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HFSS and Pantheon PCB/Hybrid/RF layout design application have an enhanced bidirectional link. Design can begin either in HFSS or layout, with the latest improvements further automating transfer of design intelligence. Reportedly saves considerable time during RF design; design cycle times are reduced by half or more.

Intercept Technology, www.intercept.com/solutions/rf-design.html

DSEC Series high-speed dual-stack edge-card socket accepts two 1.6 mm-thick PCB cards. This 0.8 mm pitch system, in a right-angled configuration, permits dual-stacked cards at 7 mm spacing between cards. Available with 30, 40 or 50 edge-rate contacts per row. Is optimized for signal integrity and impedance control, high cycles, reduced broadside coupling, and low insertion and withdrawal force. Pb-free solder charge terminations for easy board processing are standard; SnPb solder charges optional. Additional card spacings and an elevated single-card system also available.

Samtec, www.samtec.com

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