Microfill EVF Via Fill is said to enhance via filling at low surface thicknesses and is capable of simultaneous through-hole plating. Is suitable for HDI and IC substrate applications.

Dow Electronic Materials, www.dow.com

Technistan Ag high speed tin-silver alloy electroplating process for use in electronic connector and component applications. Is said to produce a SnAg5 bright electrodeposit at current densities of up to 300 ASF / 30 ASD. Is also capable of producing other SnAg alloy compositions, depending on application. For semiconductor components, connectors and other applications.

Technic, www.technic.com

 

WAGO Corp. presents the 805 Series. Wiring through push-in and push-button-actuated terminations. Comes in 2-pole to 24-pole configurations. Has 3.5-mm pin spacing for conductors AWG 24-16. UL/CUL certified at 300 V/10A. Said to offer the industry’s only internal factory-installed jumper system for conserving conductor capacity in high-density applications. Conductor entries are 0° (parallel to PCB). Optional test port provides direct contact to current bar. Staggered 1 solder pin/pole alignment.

www.wago.us

Zuken introduces CR-5000 Board Designer version 12. Said to increase electronic product design quality. Enhanced wire length control with the ability to generate arc corners. Extended list output for hole drawing. Edit prohibited layers. Allows dimension lines input to conform to the American Society of Mechanical Engineers standard. Forward annotation enhanced. IDF/DXF interfaces support default parameters. Layer consistency checks. Verification and checking results can be output into Excel format.

www.zuken.com