Tactilus heat-sink analysis system enables test and correction of surface contact and pressure distribution between the heat sink and its source. Can visualize actual contact forces and pressure distribution data on the components. As mounting screws between the CPU and the heat sink are torqued, it maps and measures the changing pressure distribution between the mating surfaces and displays it. Can be tested, manipulated, and repositioned in real-time. Provides pressure data needed for FEA simulation predictions. Is 0.015" thick; can be placed between the CPU and heat sink without affecting assembly. Sensor pad has 625 resistive sensing points arrayed on a 25 x 25 grid. Total sensing area is 2" x 2". Scan speed is up to 1,000 Hz; operating pressure range is 0 to 100 psi. Windows-based software creates pressure vs. time graphs and histograms; performs 2D, 3D and 360° image rendering and region of interest scaling; displays max., min., and average pressures and does force integrations, and prepares reports through Excel, ASCII, or Access.

Sensor Products Inc., www.sensorprod.com/dynamic/heatsink

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