New Products

Presa RMK-30 immersion tin for PWG/ PKG produces thick deposit and mitigates tin whiskers.  Compatible with virtually all commercial solder masks; usable in vertical or horizontal equipment. Deposits via displacement on copper surface. Tin deposit said to maintain excellent solderability, even with higher temperatures and following long storage. Fluoride-free bath operates at relatively low temperatures; delivers consistent performance throughout long service life. Compatible with eutectic and Pb-free solder; meets requirements of press fit connections.

Uyemura Intl. Corp., www.uyemura.com
Riston PlateMaster PM300 dry film photoresist is a fine line copper/tin and copper/solder plating film. Is said to have excellent resolution and wide processing latitude.

DuPont Electronics and Communications, http://electronics.dupont.com
Idealine silver halide phototooling plotter film is for fine line and feature imaging. Is said to improve dimensional stability.

DuPont Electronics and Communications, http://electronics.dupont.com
Pyralux flexible laminate is for high-speed digital and high-frequency applications. Comes in a variety of thicknesses, with a Dk as low at 2.3 and a dissipation factor down to 0.002.

DuPont Electronics and Communications, http://electronics.dupont.com

CB500 removable conductive silver plating ink is a screen-printed ink for selective electroplating. Is for additive, low-temperature processing on rigid and flex boards. Reportedly eliminates need for bus bars or other copper plating connections; reduces chance of forming unintended copper antennae; removes need for after-plating.

DuPont Electronics and Communications, http://electronics.dupont.com

CircuitSpace v. 4.0 advanced placement and design reuse software now comes with template viewing and cluster mirroring capabilities. The template viewer is a complete graphical user interface, enabling viewing of parametric information for each component along with an image of the template. Allows review of reuse template graphically before applying it to the design to ensure the correct IP for the circuit. Mirror clusters allows templates to be applied where the master component is mirrored, to apply a template etch to a cluster that has been mirrored, and propagates etch from/to clusters that are and are not mirrored. Other enhancements include a swap cluster command, support for clustering based on a PDF version of the schematic, enhancements to the compare checkpoint report to support testprobe information, and more.

EMA Design Automation, www.ema-eda.com/CircuitSpace

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