SlimStack board-to-board connectors have 0.40 mm pitch, 0.70 mm mated height and 2.60 mm width. Reportedly offer about 25% space savings compared to many competitive 0.40 mm pitch types. Features include two-point contact design and 0.18 mm wipe length; nickel-barrier plating; tactile click sound and feel, and gold-plated terminals. Are available in 20 - 50 circuits and have four solder tabs on each mating side. System is rated at 50V and 0.3A.
 
Molex Inc., www.molex.com/product/bb/slimstack04mm.html

The Fine Silver Conductor Trial Kit is capable of producing fine lines down to 80 µm using a set of screen printers and a thermal oven. Provides a solution to overcome challenges with fine polymer thick film circuits and functional printable and flexible electronics. Includes silver ink, flexible substrates and a processing manual with circuit samples. Is possible to generate 100 µm fine silver conductor traces on flexible substrates. Includes 100 g of silver ink, flexible film substrates with special treatments, a processing manual, MSDS and examples of finished flexible circuits.
 
DKN Research, www.dknresearch.com

MicroLine 1000 E UV laser system is for separating thin or flexible assembled and unassembled panels.

Measurement Suite for Mobile WiMAX software suite is said to speed testing of modular RF instrumentation of mobile WiMAX devices. Based on PXI Express instrumentation, the suite reportedly performs error vector magnitude (EVM), power and spectral measurements three to five times faster than traditional instruments. Typical residual EVM accuracy of -46 dB at 3.5 GHz (-10 dBm). Supports channel bandwidths from 1.25 to 28 MHz and fast Fourier transform (FFT) sizes 128, 256, 1024 and 2048, as well as all Mobile WiMAX modulation types with both convolution coding and turbo convolution coding. Generates or analyzes signals with up to eight zones and 16 bursts.
 
National Instruments, www.ni.com/automatedtest/WiMAX