Printed Circuit Design & Fab Online Magazine - New Products

New Products

804 and 805 series interconnects are for high pin count I/O and board-to-board applications. Triple row pin field permits signal connections to be densely packaged. Triple row package is on 0.100" grid; is available from 9 to 96 position configurations (ordered in increments of 3). Are RoHS-compliant, featuring high-temperature thermoplastic insulators compatible with Pb-free soldering temperature requirements. Receptacle shells are plated with pure matte tin. Have hard gold plating. Feature high-speed screw-machined pins and receptacles manufactured to precision tolerances. Inside each 805 series receptacle is a stamped beryllium copper contact clip with a pin acceptance range of 0.025 - 0.037" diameter or a .025" sq. post and a current rating of 4.5A.

Mill-Max Mfg. Corp., www.mill-max.com

PE-50 XL benchtop plasma cleaner includes an implosion-proof rectangular welded aluminum vacuum chamber. Has a chamber working area of 8" x 8" x 4". Standard features included single 5" x 5" horizontal electrode; 125W @ 50 kHz RF generator; precision needle valve flow control 0-25 CC/min; Pirani vacuum gauge 0-1 torr; 5 CFM oxygen service vacuum pump, and a single process sequence. Applications include medical devices, solar cells, printed circuit boards, connectors, MEMs, nanotechnology and wafer-level packaging.

Plasma Etch, www.plasmaetch.com

Sherlock automated design analysis software analyzes, grades and certifies expected reliability of printed circuit board assemblies. Can design-in product reliability earlier in the product development process; provides results within hours. Incorporates physics-of-failure.

DfR Solutions, www.dfrsolutions.com

Reference Design Library Beta is available online. Is an interactive resource for design engineers. Permits filtering based on the designs’ measured performance. Can find a variety of AC/DC and DC/DC conversion, audio amplifiers, and lighting driver designs, along with motion and power management resources. New models and solutions are added weekly.

Digi-Key Corp., www.digikey.com

Plasma Finish is an ultrathin fluoropolymer coating applied using a plasma deposition chamber. Reportedly creates a continuous, defect-free film that is just nanometers thick everywhere that the active gas plasma comes into contact with the surface, including high aspect ratio vias. Has stable chemical properties said to greatly extend PCB shelf life, actively repelling water and preventing contact with corrosive gasses. Ensures wettability. Combined with a precleaning step, eliminates activating, plating and rinsing stages in a traditional line. Is completely removed during solder joint formation, resulting in a reliable CuSn intermetallic layer.

Semblant, www.semblantglobal.com

AWR Connected for ODB++ PCB layout verification design flow is for connecting third-party printed circuit board tools with Microwave Office and AXIEM software solutions. Specifically moves layout data from a PCB vendor tool into an independent file format ready for use and import into AWR software. Gives the user the ability to selectively import either by net or region. Highlights include: Import layout from PCB tools for EM analysis; full PCB, arbitrary section, and/or select traces with proximity; schematic automatically created from component information; apply EM ports and wire automatically into schematic, and complement existing AWR Connected bidirectional flow with Mentor Graphics that support full co-design at all stages.

AWR Corp., www.awrcorp.com