Silver Zebra elastomeric connector is for most electronics packages. Uses a component-to-board or board-to-board design. Offers a current carrying capacity up to 0.700 A per square 0.040"; exhibits a contact resistance of less than 0.50 Ω. Creates redundant electrical contact; incorporates 240 alternating layers of silver-filled conductive elastomer and nonconductive silicone material per inch of connector. Provides a centerline pitch between layers of 0.004" and permits 0.015" pad spacing on the PCB. Is also available with an outer installation barrier.
Fujipoly America, www.fujipoly.com
PSR-4000 CC200 HRS is a high productivity solder mask designed for curtain coating. Is said to have fast exposure time and resistance to harsh final finishes such as immersion tin.
PSR-4000 QD was formulated for coating and drying performance in spray applications. Is suited for coating equipment that uses IR tack drying. Reportedly has fast photospeed and resistance to harsh final finishes.
PSR-4000 LDI (US) is a screen-printable solder mask for laser direct imaging. Has fast photospeed and is a dark green color. Curtain coatable version to be available.
PSR-4000 W8 “super white” solder mask, for LED applications, is formulated for reflectance and to resist color change from the high heat and UV associated with LED lighting applications.
Taiyo America, www.taiyo-america.com
Eagle 2100 is a 3-D negative electrodeposited photoresist for a variety of substrate sizes and geometries. It provides uniform and defect-free coatings and excellent resolution.
Dow Electronic Materials, www.dow.com
Pallamerse SMT 2000 electroless palladium final finish is for use in ENEPIG (electroless nickel electroless palladium immersion gold) processes for both SMT and gold wire bonding assembly applications. Has lower gold content, yet sustains uniform gold thickness distribution and reliable solderability with reduced gold consumption.
Dow Electronic Materials, www.dow.com
Circuposit 3350-1 electroless copper offers plating coverage and reliability, stable operation, and reduced chemical consumption and waste generation for MLB (Multi-Layer Board) and HDI applications. Circuposit 7800 desmear is for semi-additive processes and is said to offer uniform and stable adhesion promotion treatment and reliable via bottom cleaning. Reportedly provides excellent plating coverage, high peel strength and reliability. Circuposit 3323A Conditioner is a biodegradable conditioner for plated-through hole processes, offers excellent coverage and lower surface tension.
Dow Electronic Materials, www.dow.com
Microfill EVF Via Fill is said to enhance via filling at low surface thicknesses and is capable of simultaneous through-hole plating. Is suitable for HDI and IC substrate applications.
Dow Electronic Materials, www.dow.com