No. 1002 is an electrically heated, 500ºF cabinet oven used for various test procedures. Is 20" x 20" x 20". 8KW is installed in Incoloy-sheathed tubular elements to heat the unit; a 400CFM, 1/3-HP recirculating blower provides horizontal airflow across the load. Features 4" insulated walls throughout, type 304, 2B stainless steel interior with continuously backwelded seam construction, stainless steel exterior with #4 brushed finish, three nickel-plated wire shelves and adjustable opposed louvers on full coverage supply and return ductwork. Is equipped with all safety equipment for handling flammable solvents.
The Grieve Corp., www.grievecorp.com
Speedflex flex-rigid PCB design option is now available for Speedstack PCB layer stackup design tool. Creates and documents PCB stackups, combining rigid and flex-rigid PCBs. Provides a fast process said to build stacks in minutes, document drills, display stacks as 2-D or 3-D image, and add controlled impedance. Does not limit the number of layers that can be added, or the number of cross-sections that can be created and compared, including coverlays, adhesives, and no-flow prepreg layers. Can be exported in industry standard file formats.
Polar Instruments, www.polarinstruments.com
Elpemer RC 2054 HR is a photoimageable, aqueous-alkaline developable 1-pack etch resist said to offer resolution up to 25 µm. Reportedly is fast drying, with low exposure energy and short stripping times. Can be applied by roller coating, curtain coating or dipping. It is free of filling agents and pigments.
Lackwerke Peters, www.peters.de
EP2 Enhanced Polyimide is a filled product with copper adhesion superior to traditional polyimides. Is said to reduces water absorption,
(by 25%) increase thermal conductivity and reduce CTE while maintaining the full 250°C Tg of polyimide for thermal stability through process and application. Reduces cure cycle by 25 - 50%. Z-axis expansion is 0.65% at 50° to 260°C, copper peel is 25% higher than traditional unfilled polyimides, and Td (5%) is 424°C compared to traditional polyimides. Meets IPC-4101/40 and 41. Non-MDA chemistry resists drill fracturing. Is compatible with lead-free solder processing. Meets NASA outgassing and UL-V0 flammability requirements. Is RoHS and WEEE compliant.
Arlon, www.arlon-med.com