New Products

No. 1002 is an electrically heated, 500ºF cabinet oven used for various test procedures. Is 20" x 20" x 20". 8KW is installed in Incoloy-sheathed tubular elements to heat the unit; a 400CFM, 1/3-HP recirculating blower provides horizontal airflow across the load. Features 4" insulated walls throughout, type 304, 2B stainless steel interior with continuously backwelded seam construction, stainless steel exterior with #4 brushed finish, three nickel-plated wire shelves and adjustable opposed louvers on full coverage supply and return ductwork. Is equipped with all safety equipment for handling flammable solvents.

The Grieve Corp., www.grievecorp.com   

Speedflex flex-rigid PCB design option is now available for Speedstack PCB layer stackup design tool. Creates and documents PCB stackups, combining rigid and flex-rigid PCBs. Provides a fast process said to build stacks in minutes, document drills, display stacks as 2-D or 3-D image, and add controlled impedance. Does not limit the number of layers that can be added, or the number of cross-sections that can be created and compared, including coverlays, adhesives, and no-flow prepreg layers. Can be exported in industry standard file formats.
 
Polar Instruments, www.polarinstruments.com

 

A prototyping peripheral add-on board for NanoBoard FPGA-based development boards works with the fixed-FPGA NanoBoard 3000 and NanoBoard NB2. Comes in packs of three or 20. Reportedly eliminates need to create custom PCBs for circuit prototyping. A single on-board connector plugs into the NanoBoard to give direct access to the I/O on the host NanoBoard FPGA and common NanoBoard resources, including power and JTAG lines. Can integrate custom circuitry with standard NanoBoard peripherals and services, using the land patterns and plated hole connections on the prototyping boards to construct custom hardware. Supports a variety of surface mount packages in varying pitches, as well as through-hole components on 0.1" or 0.05" grids. Predefined land patterns for SMD accommodate pitches of 0.5, 0.65, 0.8 and 1.27 mm; each SMD pad is connected to a 0.5 mm hole. Board identification is achieved using a 1-wire compatible unique ID device.
 
Altium Ltd., www.altium.com

Elpemer RC 2054 HR is a photoimageable, aqueous-alkaline developable 1-pack etch resist said to offer resolution up to 25 µm. Reportedly is fast drying, with low exposure energy and short stripping times. Can be applied by roller coating, curtain coating or dipping. It is free of filling agents and pigments.

Lackwerke Peters, www.peters.de

 

 

 

BM10 series FPC-to-board connectors are RoHS-compliant and halogen-free. Are available with stacking heights of 0.6 and 0.8 mm; feature 2.98 mm depth and 0.4 mm contact pitch. For use in printers, industrial controls, medical and instrumentation equipment, and multimedia devices. The 40-position connectors feature enhanced self-alignment mechanism via guidance ribs, with a self-alignment range of 0.3 mm. Have metal fittings and a clipping contact design.

Hirose Electric Co. Ltd., www.hiroseusa.com 

EP2 Enhanced Polyimide is a filled product with copper adhesion superior to traditional polyimides. Is said to reduces water absorption,
(by 25%) increase thermal conductivity and reduce CTE while maintaining the full 250°C Tg of polyimide for thermal stability through process and application. Reduces cure cycle by 25 - 50%. Z-axis expansion is 0.65% at 50° to 260°C, copper peel is 25% higher than traditional unfilled polyimides, and Td (5%) is 424°C compared to traditional polyimides. Meets IPC-4101/40 and 41. Non-MDA chemistry resists drill fracturing. Is compatible with lead-free solder processing. Meets NASA outgassing and UL-V0 flammability requirements. Is RoHS and WEEE compliant.

Arlon, www.arlon-med.com

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