New Products

HARTING Technology Group introduces DIN 41612 types 3B and 3C connectors designed for smaller PCBs.
 
The connectors are based on 0.1-inch contact spacing and carry 2 A per contact. They come with 20 or 30 pins and are tested according to the IEC 60 603-2.
 
The male and female connectors are available with or without fixing flanges. They are suitable for press-in termination, wave soldering and surface mount compatible processes.
 
Customer specific assemblies are also available.
 
www.harting.com
Creative Materials Inc. introduces 125-17 dielectric ink. The low-odor, sky-blue ink can be used as a protective insulating layer and crossover layer for polymer thick-film conductive inks in PCB applications. Features include excellent flow characteristics, flexibility and print quality.
 
The printed void-free coating is compatible with a variety of substrates, including polycarbonate, polyester and glass. It is resistant to humidity, temperature changes and solvents and was designed for use with a variety of CMI conductive silver and carbon inks. 

The ink is also ultraviolet-curable and screen-printable, and it can be used in numerous applications such as membrane switches, flex circuits and touch screens.
 
www.creativematerials.com
California Micro Devices introduces the CM1624, a microSD interface protection filter for mobile and computing devices.
 
The product protects against ESD damage to the flash memory card or hardware, as well as curbs EMI, while providing digital signal integrity.
 
Features include: rise times as fast as 5 nSec with 75 MHz clocks in a 50-ohms environment; low line capacitance of 12 pF at operating voltages; and attenuation from 700 Mhz to 3 GHz.
 
The CM1624 has integrated pull-up resistors, removing the need for additional circuitry on the PCB handset and lowering costs. It is available in an industry standard, compact, RoHS-compliant microDFN16 package.  

www.cmd.com
ANSYS Inc. introduces Icepak 12.0 software, providing robust and powerful fluid dynamics technology for electronics thermal management.
 
The latest version contains several advancements, including technology for meshing complex geometry and physical modeling capabilities.
 
The software quickens product development by accurately simulating dissipation of thermal energy in electronic devices at the component, board or system level. Users can improve design performance, reduce the need for a physical prototype and shorten time to market.
 
ANSYS Iceboard and Icechip capabilities are integrated into this latest version, and ECAD designs can be directly imported. Additional features include enhanced fan modeling, parallel processing, post-processing and expanded libraries.
 
In addition, a PCB trace Joule heating modeling capability, together with the import of DC power distribution profiles from Ansoft SIwaveT software enhances accurate PCB thermal simulation.

www.ansys.com
 
 
 
 
Leader Tech Inc. introduces its CBS Product and Design Guide, a board-level shielding catalog and engineer’s design guide.
 
The brochure contains detailed information regarding standard, modified standard and custom CBS products. Features include: a quick-glance product comparison chart, cover retention data and shielding performance published for each CBS series.
 
In addition, e
merging EMI shielding design and manufacturing processes have a complete section in the guide, which can be downloaded free from the company’s website: www.leadertechinc.com.
SIwave v4.0 is capable of broadband signal- and power-integrity analyses along with DC voltage and current analysis for complete boards and packages. According to Ansys, SIwave v4.0 has the ability to couple board and package electromagnetic fields with HFSS(TM) technology for complete system-level simulation. Enhanced GUI aids component management and allows simultaneous analyses and dynamic zooming. Software includes automated error checking and geometry correction and allows native merging of packages to boards.

Version 4.0 includes new features for signal-integrity, power-integrity and electromagnetic compatibility testing, providing accurate solutions beyond 10 Gb/s. Links to other products can enable accurate characterization of additional heating due to copper-resistive losses that have previously been estimated or ignored completely.

This latest release includes multiple automation enhancements that ease design flows by removing manual manipulations. Automated error checking and geometry correction have been implemented. Schematic creation, transient and QuickEye analyses setups have been automated for circuit simulation driven by electromagnetics when using SIwave with Ansoft Designer.

www.ansys.com

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