GHS-51 high-speed electrolytic process is said to prevent whisker formation in electroplated tin for 22,000 hr. Sissipates compressive stress, preventing whisker formation. Uses a high purity anode, suited for connectors and semiconductor leadframes. Offers high deposition speeds for rackless and reel-to-reel processing, and high deposition efficiency over a wide current density range. Bath is lead- and fluoride-free, and foam-resistant. Operating range 113-131^oF, with 122^o the optimum. Film has uniform white matte appearance. Carbon and sulfur concentrations in the film are very low, and control over liquid level is easy. Is reportedly heat-resistant, with excellent solderability.

Uyemura International Corp., www.uyemura.com

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