New Products

Pyralux TK flexible circuit material is a copper-clad laminate and bonding film specifically formulated with Teflon fluoropolymer film and Kapton polyimide film for high-speed digital and high-frequency applications. Contains no glass. Dk is 2.3 to 2.7; Df is 0.002 or 0.003, depending on the film construction. Is designed for high-speed flex applications, including microstrip and stripline-controlled impedance constructions. A variety of copper foil weights are available: standard foils are 18 and 35 µm rolled annealed copper. Is a layered dielectric. Teflon is also available separately as a sheet adhesive. Comes in laminate thicknesses of 50, 75 and 100 µm. Bondply thicknesses are available in 75 or 100 µm.

DuPont Circuit and Packaging Materials, www.DuPont.com

 

Halogen-free Embedded Capacitance Material is said to improve power integrity and reduce electromagnetic interference. Is compatible with standard rigid and flexible PCB processing, including laser drilling. Is RoHS compliant. Is a thin, high-performance capacitor laminate that can be embedded into PCBs and computer chip packages to reduce impedance, power bus noise, PCB EMI and discrete capacitor count.

3M Electronic Solutions Division, www.3Mcapacitance.com

Embedded Capacitance Materials simulation model is for use in HFSS and SIwave software. Is said to address noise issues early in the design cycle by incorporating the ECM into design simulations, resulting in fewer design spins. Is a thin, high-performance embedded capacitor laminate that helps reduce impedance, power bus noise, EMI and discrete capacitor count. Is compatible with most rigid and flex PCB processing, including laser drilling.

3M Electronic Solutions Division, http://www.ansoft.com/products/hf/hfss/3MEmbeddedCapacitanceMaterial.cfm
ANSYS Inc., www.ansys.com

This tool family is said to migrate designs from all major CAD tools into CadSoft EAGLE. The standalone tool converts schematic and PCB designs from PCAD, while upcoming releases will support other major CAD tool design and library conversions. Features that may not translate well are highlighted for review. Conversion services are offered from Alegro, Altium, BoardStation, CadStar, CR-5000, Expedition, Orcad Layout, Pads, Protel, and Visula.

Stratford Digital, www.eaglecentral.ca

CSL-A25T cut sheet laminator is for flexible and thin core substrates. Has the capability to laminate substrates up to 25" wide, from 0.05 to 3.5 mm thick.

Christopher Associates, www.christopherweb.com

High-performance phototool film enclosures are made from rugged, corrugated board. Package currently is used for delivery of Tecnilith Amber film. Eliminates styrofoam and cardboard spacers common in previous three-piece configurations. Films ship in a single package with no risk of shedding. Within the box, films are enclosed in a vacuum-sealed foil bag that opens easily and is re-closable. Films are supplied with three rounded corners and a square notch, an indicator of the emulsion side. Conventional fiberboard package stiffeners have been replaced with black plastic cleanroom-compatible ones.

Exopack Advanced Coatings, www.exopackadvancedcoatings.com

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