Syron 7000 and 7100 thermoplastic laminates are said to have higher melt temperature than PTFE. Have estimated UL relative thermal index of greater than 210°C. Are flame-retardant, halogen-free and compatible with Pb-free solder processes. Resistant to solvents and reagents commonly used in printed circuit board processing; can operate in harsh chemical environments. Are suitable for flex-to-install applications, lightweight feed manifolds, automotive sensors, and in electronics for oil and gas exploration. Are available with 0.5 oz. low-profile electrodeposited copper foil cladding and in panel sizes that include 12" x 18" and 24" x 18". Feature dielectric thickness of 0.002" with thickness tolerance of ± 12.5%. Have max. z-axis Dk of 3.4 at 10 GHz, with max. z-axis dissipation factor of 0.0045 at 10 GHz. Offered with dielectric thicknesses of 0.002" and 0.004"; tolerance of ± 12.5%.

Rogers Corp., www.rogerscorp.com

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