3D Forming FPC is a three-dimensional flexible substrate consisting of thermoplastic liquid crystal polymer and copper foil. Withstands reflow temperatures up to 260°C, and has thermal conductivity of 0.5W/m·K, water absorption rate of less than 0.04%, and and dielectric loss tangent of 0.0025. 

Nippon Mektron, www.mektron.com 

 

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