InCAM 2.03 is for high-density interconnect and integrated circuit packaging production. Includes DfMs for automatic track centering and via stack staggering. A DfM for stacked via balancing prevents board scrap caused by material deformation during lamination on partial stacked vias. Includes functionality for adding panel tooling holes using predefined pad stacks. Improves existing functions. Has stacked via balancing for detecting and preventing the deformation of buildup boards containing via stacks that are not stacked on all pressed layers; stagger via stacks for staggering the position of stacked vias; DfM track centering for centering tracks between adjacent pads and/or drills, and pad stack , a library entity that enables adding a full pad stack to a layer in one action; useful for adding panel tooling holes.

Frontline PCB, www.frontline-pcb.com

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