Speedflex HDI is for printed circuit board stackup design and documentation. Collates libraries of materials, costs and suppliers with design data, such as transmission line specifications or impedance control. Documents can be shared at every stage of the PCB supply chain. Calculates possible impact of substituting alternative materials. Navigator guides though stackup process and presents complete assembly in a graphical display that highlights the flex regions within the flex-rigid PCB. User-definable settings permit display of layers in transparent, invisible or 3-D mode. Flexible adhesives, bond ply and FlexiCore can be enabled or disabled for each layer, and impedance structures can be added to each sub-stack. Can use alternate data streams to store summary stack information, including layer count, thickness, copper thickness, etc.

Polar Instruments, www.polarinstruments.com 

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