Reconfigurable mini probe station model W4.0 x L6.5 is used to test a chip or small printed circuit board that can’t wait for local lab probe station availability. Has footprint of 22" x 9" x 8" and can be used at the desk or a lab. Weighs 9lbs. Is fully manual with 4" x 6.5" test plate with vacuum holes and wide probe holder plates on each positioner with multiple holes for probe mounting. Both positioners can slide back and forth in the X and Y directions and can be moved toward the DUT at the angle. Height positioning is accomplished via digital micrometers, and each positioner can be locked independently. Magnetic plates attach to normal probe mounting holes to allow additional magnetic x-y-z positioners with fine adjustment; probe arms are adjustable in the x, y, z and theta axes.

D-Coax, www.D-COAX.com

Contac S4 enables through-hole plating on a laboratory scale, as a result of a cleaning step for microvias. Station can be equipped with up to six baths. Generates through-holes with aspect ratios of up to 1:10, even on multilayer boards with up to eight layers. Tolerance in layer buildup is +/- 2µm. Tin-plating step improves solderability.

LPKF, www.lpkf.com

ProtoMat E44 printed circuit board plotter is for mechanical milling and drilling of PCBs out of fully coated base substrates. Features increased spindle speed and a camera for read-in of material position; enables production of double-sided PCBs with micron-level precision and control of the milling channel width. Requires power outlet and dust extraction unit for operation. Is designed for training purposes or occasional use.

LPKF, www.lpkf.com

Ansys 17.0 features improvements across the entire workflow, from modeling to post processing. SpaceClaim Direct Modeler speeds time to CAE with improved performance for importing complex models and more tools for faster geometry creation and editing. New industry-specific vertical solutions facilitate OEM-supplier interactions while adhering to such industry standards, such as ARINC 664/653, FACE and AUTOSAR. Chip-package-system design workflow for electronics is more tightly integrated and automated, and now includes across-the-board performance improvements for power integrity, signal integrity and EMI analyses. High performance computing improvements provide 20 to 60X performance gains for package and board simulation. Thermal analysis in now integrated and automated in SIWave.

Ansys, ansys-blog.com/introducing-ansys-17/