J750 3D printer produces full color, multi-material prototypes and parts in a single 3D. Color palette contains more than 360,000 different shades plus multiple material properties, ranging from rigid to flexible and opaque to transparent. New PolyJet Studio software's new intuitive user interface allows material selection, optimizes build, and manages print queues. Assignment of colors, transparencies and rigidity is eased via familiar design controls. Color textures can be loaded fully intact via VRML files imported from CAD tools. Minimizes downtime associated with material changeovers. Features a large, six-material capacity to keep the most-used resins loaded and ready for printing. Newly designed print heads means simulated production plastics, like Digital ABS, cuts 3D-print times by up to 50%.
HyperLynx integrates signal and power integrity analysis, 3D-electromagnetic solving, and fast rule checking into a single unified environment. Based on HyperLynx signal integrity/power integrity (SI/PI) application, now offers a complete set of analysis technology sufficient for designing any type of high-speed digital printed circuit board. Simulation engines and graphical user interface support both quick/interactive and exhaustive batch-mode analysis. Now offers 2D/3D signal and power integrity analysis in a single application, with one GUI. Allows, for example, simulation of a critical SERDES channel, and then — by selecting a single new menu item — analysis of a large power net's decoupling. Combines fast geometry extraction engine and advanced materials modeling (for wideband dielectrics, copper roughness, etc.) for accurate simulation. Provides advanced electromagnetic solvers, including full-wave 3D, for increasingly fast SERDES technologies. 3D engine is deeply integrated, so the user never has to learn the intricacies of a full-wave-solver environment. Integration ensures signal and power structure geometries are passed; electromagnetic (EM) ports are formed; simulations are run; and S-parameter results are incorporated into time-domain simulations – automatically. Includes multiple engines — two 2.5D solvers, DC/IR-drop simulator, and quasi-static 3D solver — to enable a full set of PI features, all of which are available side-by-side in the same application as the tool's SI capabilities. A second, more advanced 2.5D solver is capable of pure power and mixed signal-and-power modeling, which can be used to add accuracy to SI simulations when simultaneous-switching-noise (SSN) complications are suspected. DDRx memory interfaces wizard extends to DDR4 and LPDDR4 interfaces. HTML-based reporting allows creation of design documentation and internal Web-based "publication" of results. For SERDES, protocols that support Channel Operating Margin (COM) allow checking the quality of links based on a specific, complex set of simulation steps for a single pass/fail number per-channel. Is said to have the first robust commercial implementation of COM for 100GbE signaling, with simulation details fully automated. Handles very large layouts (including extra-deep stack-ups, huge net counts, and entire multi-board systems); multi-processor and other simulation-engine performance enhancements; and caching and reuse of extracted models.
Draftsman documentation workflow for Altium Designer 16.1 provides unified documentation with customizable drawing views, documentation templates, and a complete design-to-documentation workflow. Eliminates need to import and export design files to 3rd party tools. Links directly to a designer’s PCB data.
Sherlock Automated Design Analysis software v.4.2 includes modeling of potting materials, wire bonds, housing elements (such as stiffeners), and BGA solder balls. Can reportedly perform rapid tradeoff analysis, predict failures earlier in the design process, and make changes to mitigate causes of potential product failures in test or in the field. Extracts information from design files and creates 3D FEA models of semiconductor packaging and electronic hardware in minutes. Wire bonds can be modeled directly. Can add complex housing elements and other mechanical parts directly to the board and model their possible effects.
Curamik CoolPerformance Plus liquid-cooled material dissipates large amounts of heat for thermal management of high-power laser diodes and other heat-generating optical devices. Features several layers of pure copper, taking advantage of its thermal conductivity, formed into hermetic, 3-D microchannel or macrochannel water-cooled structures capable dissipating large amounts of heat in small areas. Feature aluminum-nitride (AlN) isolation layers that separate cooling water channels from electrical contacts of laser diodes, and provide a close match in CTE (in the range of 5 to 7ppm/K) between the copper cooling structures and high-power ceramic laser diode packages for improved reliability even at high power levels.
Valor Internet of Things (IoT) Manufacturing hardware device has embedded software for live data collection from all shop-floor machines and processes, leveraging the new Open Manufacturing Language (OML) communication standard. Enables seamless implementation of advanced practices such as Industry 4.0 and Smart Factory, with plug-and-play deployment and minimal change to the manufacturing environment and work processes. Utilizes built-in interfaces to acquire and normalize data from entire manufacturing flow, including surface mount technology (SMT), screen printers, reflow ovens, inspection and test machines, as well as manual operations such as system assembly, test and repair. Provides a simple, standard way of controlling machines and manufacturing flows through the use of OML. Accelerates deployment of shop-floor IT projects by connecting with any MES, ERP, supply chain, PLM and other enterprise applications. Is highly scalability and allows parallel real-time flow of huge data volumes, eliminating potential networking and connectivity issues. Rugged construction for high data integrity and security, including power back-up and fail-safe data management.
Includes multiple engines — two 2.5D solvers, DC/IR-drop simulator, and quasi-static 3D solver — to enable a full set of PI features, all of which are available side-by-side in the same application as the tool's SI capabilities. A second, more advanced 2.5D solver is capable of pure power and mixed signal-and-power modeling, which can be used to add accuracy to SI simulations when simultaneous-switching-noise (SSN) complications are suspected. DDRx memory interfaces wizard extends to DDR4 and LPDDR4 interfaces. HTML-based reporting allows creation of design documentation and internal Web-based "publication" of results. For SERDES, protocols that support Channel Operating Margin (COM) allow checking the quality of links based on a specific, complex set of simulation steps for a single pass/fail number per-channel. Is said to have the first robust commercial implementation of COM for 100GbE signaling, with simulation details fully automated. Handles very large layouts (including extra-deep stack-ups, huge net counts, and entire multi-board systems); multi-processor and other simulation-engine performance enhancements; and caching and reuse of extracted models.
