Low transmission loss flexible multilayer printed circuit boards use resin design technology.

Bonding sheet can be laminated at less than 200°C and stored at room temp. Reportedly eliminate need for special facilities for high-temperature lamination and refrigerated storage for bonding sheets. High adhesiveness of liquid-crystal polymer (LCP) and low profile copper foil for LCP core material uses laminating techniques. Support standards including USB 3.1 Gen 2 (10Gbps) and enable increased speed of large-volume data transmission in mobile devices.

Panasonic 

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