CADStar desktop PCB design software v. 17 now incorporates Perfect Springback technology, for smooth and fast operation, restoring the previous pattern and position exactly. Is said to make routing faster and more responsive, and eliminate the need to review return positions when trying out and undoing routing options. This rubber band-like operation is seen when dragging tracks in Activ-45 mode for Activ-45 pushing. A similar operation can be found in the manual routing and lengthening tools. Is said to significantly reduce number of clicks needed to place and route, compared to traditional routing technology. Other productivity enhancements include improved routing patterns for differential pairs, and etch factor support. New ease-of-use features include: When interacting with a selection it is now possible to specify an origin used as a reference for operations such as movement and rotation; and dimensions may be added directly into PCB component.

Zuken, zuken.com/cadstar/whats-new

Nuvogo Fine dual table direct imager is designed for HDI, modified semi-additive process (mSAP) and flexible printed circuits (FPC) produced at high throughput on all types of resists. Reportedly is capable of line widths of 10μm and yields of up to 5500 panels per production line, per day. Enables precision stacking of microvias. Includes patented MultiWave Laser Technology and Large Scan Optics Technology for line quality and pattern uniformity. Provides depth-of-focus (DoF) using a single panel scan, sharp edge patterns, and uniform inline structure quality.

Orbotech, orbotech.com

MP2 all-in-one DPSS laser marking system is for applications requiring high resolution but not high-speed throughput. Diode pumped solid state (DPSS) provides pulse duration of 3ns, high peak power of 30kW and runs on 24 VDC (6A). The 1064nm infrared wavelength is suited for marking a range of materials – metals, plastics and some organics. Includes laser beam scanning optics (galvanometer), control electronics and marking software. Optional laser safe enclosure.

LNA Laser Technology, lnalaser.com/dpss-laser-marking-system

NI AWR design environment now comes with new and improved EM Socket II architecture to enhance AWR Connected for EM interoperability between third-party electromagnetic simulation tools and Microwave Office high-frequency circuit board design software. Uses AXIEM 3D planar and Analyst 3D FEM EM solvers. Leverages automation and design management developed for circuit, system, and EM co-simulation.  Enables bi-directional interoperability with Ansys High Frequency Electromagnetic Field Simulation (HFSS) software by defining an HFSS 3D layered structure, seamlessly launching an HFSS simulation and embedding S-parameter results directly back into Microwave Office without leaving the software environment.  

National Instruments, www.awrcorp.com