NI AWR design environment now comes with new and improved EM Socket II architecture to enhance AWR Connected for EM interoperability between third-party electromagnetic simulation tools and Microwave Office high-frequency circuit board design software. Uses AXIEM 3D planar and Analyst 3D FEM EM solvers. Leverages automation and design management developed for circuit, system, and EM co-simulation.  Enables bi-directional interoperability with Ansys High Frequency Electromagnetic Field Simulation (HFSS) software by defining an HFSS 3D layered structure, seamlessly launching an HFSS simulation and embedding S-parameter results directly back into Microwave Office without leaving the software environment.  

National Instruments, www.awrcorp.com

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