MCX PCB jacks are available in straight, right-angle, or edge-mount configurations, with options for surface or through-hole mounting. Are manufactured from machined brass, and plated gold or tin for solderability. Center contacts are made from beryllium copper and are gold-plated. MCX cable plugs, designed for RG-178 (RG-196) and RG-174 (RG-188, RG-316) type cables, are available in straight and right-angle configurations. Connector housings are made from machined brass, with beryllium copper outer contacts for secure mating. Housings and ferrules are nickel-plated for durability, with outer and center contacts plated gold. These 50ohm MCX connectors are designed to perform at frequencies up to 6GHz, with VSWR being 1.1 (max) at 2.5GHz, measured for right-angle configurations.
Register now for PCB West, the Silicon Valley's largest trade show for the printed circuit industry, taking place Sept. 13-15 in Santa Clara: pcbwest.com
NeoScale high-speed modular mezzanine connector now delivers faster data rates and improved performance. Offers clean signal integrity at data rates of 56Gbps NRZ. Composed of a vertical plug and vertical receptacle, with a patented modular triad wafer design for custom PCB routing in high-density applications. Patented PCB attachment method delivers robust solder joints. Is composed of three pins per differential pair—two signal pins and one shield pin. Each triad is a standalone, shielded, 56-Gbps-capable differential pair or an 8A power feed. Triads can be optimized for signals supporting high-speed 85 Ohm or 100 Ohm differential pairs, high-speed single-ended transmissions, low-speed single-ended or control signals, and power pins. Blind mateable with rugged triads for multiple connectors. Come in 12 to 42mm stack heights; circuit sizes of 8 to 300 triad wafers in 2-, 4-, 6-, 8- and 10-row configurations; and 85 or 100 Ohm impedance to provide optimal design flexibility. Customized versions available, such as 10 and 45mm stack heights.
Register now for PCB West, the Silicon Valley's largest trade show for the printed circuit industry, taking place Sept. 13-15 in Santa Clara: pcbwest.com
RO4730G3 UL 94 V-0 antenna-grade laminates meet performance requirements in active antenna arrays and small cells, notably in 4G base transceiver stations (BTS) and Internet of Things (IoT) applications as well as emerging 5G wireless systems. Flame-retardant (per UL 94V-0), thermoset laminates have dielectric constant (Dk) of 3.0, held to a tolerance of ±0.05 through the thickness (z axis) when measured at 10GHz. Are comprised of ceramic hydrocarbon materials with novel low-loss copper foil. Offer passive-intermodulation (PIM) performance better than -160 dBc typical, are 30% lighter than PTFE circuit materials, and feature a glass transition temperature (Tg) of better than +280°C for compatibility with automated assembly techniques. Z-axis coefficient of thermal expansion (CTE) of 30.3 ppm/°C from -55° to +288°C. Lead-free-process compatible. Dissipation factor of 0.0023 at 2.5GHz and 0.0029 at 10GHz.
Register now for PCB West, the Silicon Valley's largest trade show for the printed circuit industry, taking place Sept. 13-15 in Santa Clara: pcbwest.com
ACE Translator 3000 v 7.0 offers two-way translation between most common EDA, CAD, and 3D formats, in a single intuitive environment. Converts DXF, GDSII, Gerber, Postscript, PDF, ODB++, TIFF, BITMAP, STEP, STL, and more. Built-in viewer verifies translation results. Includes rulers, measurement tools, query, cell browser, hierarchy browser, HighLite broken polygons, plus new editing and repair features.
E3.series 2016 contains new usability and productivity features, plus automatic connect and auto-route functions said to significantly reduce design time and effort. Real-time, global design collaboration is possible with a true multi-user environment without sheet check-outs.
Tabular editing functionality has been extended to permit terminal strips for a whole project to be managed from within a table in a single window. Users may make changes to terminal connections directly from within the table. Placement column shows the current placement in panel layout using colors. Global search may be carried out to filter and search for terminal connections. Terminals, connectors and any devices can now be placed inside a block making blocks functional. Hierarchy within a block maximizes design reuse. Other features include automatic placement optimization when inserting, changing or deleting components; placing complete preconfigured terminal strips; and sorting terminal blocks according to customer criteria, as well as defining cabinet layout models for block components in the library. This enhances rack-based cabinet layout with predefined slots. Enhanced multi-user, real-time environment allows simultaneous work on one sheet. All objects can now be accessed online and concurrent design is achieved without needing to book out sheets.
Register now for PCB West, the Silicon Valley's largest trade show for the printed circuit industry, taking place Sept. 13-15 in Santa Clara: pcbwest.com
PXIe-5840 is a second-generation 1GHz bandwidth vector signal transceiver for RF design and test applications. Combines 6.5GHz RF vector signal generator, 6.5GHz vector signal analyzer, high-performance user-programmable FPGA, and high-speed serial and parallel digital interfaces into a two-slot module. Is suited for 802.11ac/ax device testing, mobile/Internet of Things device testing, 5G design and testing, RFIC testing, and radar prototyping. Measures 802.11ax error vector magnitude performance of -50dB. Has measurement speeds up to 10X faster than traditional instrumentation. Allows for up to 8 x 8 multiple input, multiple output configuration in an 18-slot chassis. User-programmable FPGA; can design with LabVIEW.
Each triad is a standalone, shielded, 56-Gbps-capable differential pair or an 8A power feed. Triads can be optimized for signals supporting high-speed 85 Ohm or 100 Ohm differential pairs, high-speed single-ended transmissions, low-speed single-ended or control signals, and power pins. Blind mateable with rugged triads for multiple connectors. Come in 12 to 42mm stack heights; circuit sizes of 8 to 300 triad wafers in 2-, 4-, 6-, 8- and 10-row configurations; and 85 or 100 Ohm impedance to provide optimal design flexibility. Customized versions available, such as 10 and 45mm stack heights.
