EMD5805 nanosilver ink for use in digital and direct-write systems, feature low-temperature sintering properties and a unique chemistry for long open life and superior jetting performance. Optimized for aerosol jet systems. Can be used for prototype and production.

Sun Chemical, sunchemical.com

LM1000 grid tester for bare board PCBs can be fitted with universal or dedicated fixtures. Uses modern double shuttle concept with high-speed linear drives and integrated optical high-resolution scanning. Test heads can be stepped precisely over product for high first-pass rates by micro-aligning each image individually. Handles boards up to 300 x 300mm. Maximum test area is 163 x 244mm (6.4"x 9.6").

atg Luther & Maelzer, atg-lm.com

J750 3D printer produces full color, multi-material prototypes and parts in a single 3D. Color palette contains more than 360,000 different shades plus multiple material properties, ranging from rigid to flexible and opaque to transparent. New PolyJet Studio software's new intuitive user interface allows material selection, optimizes build, and manages print queues. Assignment of colors, transparencies and rigidity is eased via familiar design controls. Color textures can be loaded fully intact via VRML files imported from CAD tools. Minimizes downtime associated with material changeovers. Features a large, six-material capacity to keep the most-used resins loaded and ready for printing. Newly designed print heads means simulated production plastics, like Digital ABS, cuts 3D-print times by up to 50%.

Stratasys, stratasys.com

HyperLynx integrates signal and power integrity analysis, 3D-electromagnetic solving, and fast rule checking into a single unified environment. Based on HyperLynx signal integrity/power integrity (SI/PI) application, now offers a complete set of analysis technology sufficient for designing any type of high-speed digital printed circuit board. Simulation engines and graphical user interface support both quick/interactive and exhaustive batch-mode analysis. Now offers 2D/3D signal and power integrity analysis in a single application, with one GUI. Allows, for example, simulation of a critical SERDES channel, and then — by selecting a single new menu item — analysis of a large power net's decoupling. Combines fast geometry extraction engine and advanced materials modeling (for wideband dielectrics, copper roughness, etc.) for accurate simulation. Provides advanced electromagnetic solvers, including full-wave 3D, for increasingly fast SERDES technologies. 3D engine is deeply integrated, so the user never has to learn the intricacies of a full-wave-solver environment. Integration ensures signal and power structure geometries are passed; electromagnetic (EM) ports are formed; simulations are run; and S-parameter results are incorporated into time-domain simulations – automatically. Includes multiple engines — two 2.5D solvers, DC/IR-drop simulator, and quasi-static 3D solver — to enable a full set of PI features, all of which are available side-by-side in the same application as the tool's SI capabilities. A second, more advanced 2.5D solver is capable of pure power and mixed signal-and-power modeling, which can be used to add accuracy to SI simulations when simultaneous-switching-noise (SSN) complications are suspected. DDRx memory interfaces wizard extends to DDR4 and LPDDR4 interfaces. HTML-based reporting allows creation of design documentation and internal Web-based "publication" of results. For SERDES, protocols that support Channel Operating Margin (COM) allow checking the quality of links based on a specific, complex set of simulation steps for a single pass/fail number per-channel. Is said to have the first robust commercial implementation of COM for 100GbE signaling, with simulation details fully automated. Handles very large layouts (including extra-deep stack-ups, huge net counts, and entire multi-board systems); multi-processor and other simulation-engine performance enhancements; and caching and reuse of extracted models.

Mentor Graphics, mentor.com/pcb/hyperlynx