Printed Circuit Design & Fab Online Magazine - New Products

New Products

MacuSpec HT 360 is a direct current acid copper plating process. Reportedly offers excellent microdistribution at high current densities. Provides throwing powers of greater than 80% at current densities up to 30 ASF in through holes with aspect ratios of 8:1. Deposits reportedly exceed IPC Class 3A tensile strength and elongation requirements; pass all thermal reliability testing. Components are analyzable by CVS.

MacDermid Enthone, http://www.macdermid.com/companies/macdermid-enthone-electronics-solutions/

Altium Designer 17’s new features include ActiveRoute for designing printed circuit board layouts with guided routing technology; dynamic copper to modify copper polygon shapes; back drilling to reduce signal integrity disturbances on high-speed designs with control over drill hole specifications. Altium Vault 3.0 now features streamlined project releaser to add verified project snapshots with included design variants for fabrication and assembly; customized item manager automatching to synchronize projects and define parameters to update unmanaged assets with verified design data; expand templates to keep design projects standardized. Both are free upgrades to all subscription customers.

Altium, www.altium.com

SMD shielding clips are produced in custom sizes. Are an alternative to hand soldering. Miniaturized design permits tape-and-reel packaging compatible with standard high-speed placement equipment. RFI shield clips can be placed anywhere on the printed circuit board. Are equipped with four independent spring contacts. Allow for shield removal and replacement.

Holland Shielding Systems, www.hollandshielding.com

XFdtd 3D electromagnetic simulation software can now import flexible printed circuit board designs. PCB import dialog includes the option to wrap a design onto a form automatically during the import process. The wrap option conforms the PCB and its parts onto the flexible circuit geometry. Produces simulation-ready design in one step. Also includes dielectric volume averaging.

Remcom, www.remcom.com

Xpedition multi-board systems design enables concurrent multi-discipline team collaboration. Eliminates redundant effort during design; optimizes product performance and reliability with a data management infrastructure. Reportedly ensures data integrity and leverages reusable IP across all boards, connectors, and cables. Replaces paper and manual processes with automated, fully integrated, collaborative workflow. Provides automated synchronization between all levels of abstraction and automated connector management. Offers parallel collaborative design environment where global teams can work in real-time. Features single desktop engineering environment; integrated connector management; integrated multi-board system level connectivity verification; built-in change management; and integrated library browsing.

Mentor Graphics, www.mentor.com/xpedition

SnapEDA Altium Plugin find parts from SnapEDA's cloud-based libraries directly inside the Altium design software, facilitating integration of new components into designs. Connect to SnapEDA’s cloud-based library, allowing searching and downloading of digital models for millions of electronic parts instantly. All new models conform to IPC-7351B standards and follow a three-step patent-pending verification process.

SnapEDA, www.snapeda.com/plugins