This CCL is a low loss (0.007), low dielectric constant copper-clad laminate based on the Nofia FR hardener system. Demonstrates high modulus, low coefficient of thermal expansion, good peel strength, pressure cooker resistance, and a UL 94 V-0 rating for flammability. Is for smartphone and server applications.

FRX Polymers, www.frxpolymers.com
Shengyi Technology Company, www.syst.com.cn/en

Voxel8 enables prototyping of 3D electronic devices via co-printing of thermoplastics and a highly conductive silver ink. Developer's Kit includes silver ink that prints and cures at room temperature and is 5000X more conductive than conductive pastes and filaments currently used in additive manufacturing. Deposits novel inks by directly writing materials, whose flow is controlled by an on-board pneumatic system. A 250 micron nozzle is translated to precise 3D locations within the build volume. High-precision distance sensor permits several operations to be automated for reliability. Build plate is auto-leveled by measuring the Z distance at multiple locations. Aligns printheads by measuring profile of printed registration marks.

Voxel8, voxel8.co

PA6.6 polymer combines characteristics of halogen-free flame retardancy with high flow and low migration, while reducing corrosion during the injection process. Reduces corrosion of injection machine during processing. Is UL Yellow Card certified, including 5VA flame class rating at 0.8mm thickness.

Solvay Engineering Plastics, www.solvay.com/en/index.html

Integr8tor v2016.04 sales and engineering server for auto input and design analysis provides more detailed analysis of incoming client PCB design data, enabling evaluation, costing, pricing and quoting boards without the need for CAM workload. Resolves repetitive pre-CAM work on incoming jobs, cutting up to 25% of operating time per job. Extensive DfM Classes toolkit expands on former Capabilities suite to automatically and quickly provide a reliable, comprehensive, easy-to-read visual overview of the resources needed for incoming PCB designs. Depending on manufacturer priorities, DfM Classes typically classifies the PCB according to ease of manufacture, materials and resources necessary, and cost levels by accessing and analyzing all the QED data and classifying PCB designs with respect to a broad range of predetermined, custom production parameters. Shows where a layout can be optimized. Other improvements: more sophisticated surface mount device and BGA pad analysis and count; user-defined outlines that protect the integrity of peripheral tracks and features; automatic recognition of cut-outs; feature-specific analysis of clearances between objects and outlines; improved support for Eagle and mixed unit ODB++ v8 data sets; Windows 10-compatible; added speed and simplicity.

Ucamco, www.ucamco.com