Multitouch N9041B UXA Signal Analyzer makes continuous sweeps up to 110GHz. Displayed average noise level as low as -150dBm/Hz (>50GHz). Now delivers wider, deeper views of millimeter-wave signals. Characterizes millimeter-wave signals such as 5G, 802.11, satellite, and radar. Max. analysis bandwidth of 5GHz. Provides two input connectors. Dedicated 1.0mm input connector is machined to exact tolerances. A 2.4mm input connector covers measurements up to 50GHz.
Keysight Technologies, www.keysight.com
AgIC Pen draws electrical circuits on a sheet of paper. Circuits have the capability to conduct electricity. Tracing connects and transforms different forms in 3D miniatures, such as small paper cities. Creates fully lit scenes.
Kandenko, https://www.kandenko.co.jp/en/
Ansys 17.2 includes automated antenna design workflows. Ansys Act toolkit for antenna designers includes simulation-ready HFSS designs for more than 50 commonly used antenna types. Can select antenna from library and enter design parameters. Boundaries, excitations, simulation parameters, reports and plots are generated automatically. New antenna types in the toolkit include GPS Patch Ceramic, UHF Probe, Quasi Yagi and Blade antennas. 3D component library now includes human body models for wearable device performance and support for editing component definition.
Ansys, www.ansys.com
AeroWave is a high-reliability laminate targeted toward auto radar, base station transceivers, power amplifiers, telemetry devices and antenna systems. Is a woven glass-reinforced thermoset UL-94 V0 material that reportedly exhibits excellent electrical and mechanical properties with a consistent, stable Dk and low Df over frequencies ranging 1GHz to 35GHz and temperatures from -40C°to +125C°. Low loss (0.0028 @ 10GHz) controlled dielectric constant material (+/- 0.05) is available in a range of nominal cores and pre-preg. Passive inter-modulation performance values exceeding -160dBc are typical. Can be fabricated using standard FR-4 printed circuitry fabrication processes. Is well suited for use in hybrid multi-layer printed circuit configurations. Compatible for use in PB-free assembly processes.
Shengyi Technology, www.shengyi-usa.com
Solidworks 2017 3D computer-aided design (CAD) software has more than 520 new enhancements and features. Can be used to design PCBs. New chamfer, fillet, and hole-specification tools facilitate collaboration between various team members. Users can apply multiple variable chamfers in a single operation and directly change fillets into chamfers. Can access previous hole definitions, apply pre-saved specifications, and construct stepped holes faster than in previous versions. Can create 3D geometry and surface characteristics using new surfacing features, including wrap, drag and drop, emboss, deboss, and 3D curve. A magnetic mates feature organizes assemblies by setting up connection points for drag-and-drop mating and repositioning. Suggests alternate designs. Analysis and automatic design alterations are communicated in the RealView bar. Integrates Altium electronic design software.
Dassault Systèmes, www.3ds.com
IsoPro CNC2PCB software provides ability to output DXF, Gerber, or NC drill data to computer numerical control programs. Follows EIA RS-274 industry standard; can fabricate PCB or chassis on milling center. For rapid PCB prototypes and programs for the mechanical chassis that fits the PCB. Edits and converts Gerber, Excellon drill, and DXF files for use by quick circuit prototyping systems to fabricate printed circuit boards, delrin parts, aluminum chasses and other mechanical components.
T-Tech, www.t-tech.com