RO4830 high-frequency laminates are processed by standard epoxy/glass (FR-4) circuit fabrication methods.
Are available in dielectric thicknesses of 0.005" and 0.0094". Are suited for cap layers on FR-4 multilayer PCB designs. Resin, glass and filler content translates to a relative dielectric constant of 3.2 at 77GHz. Include reverse-treated copper foil to achieve insertion loss of 2.2 dB/in. for 5 mil laminates. Are based on same antioxidant formula used in RO4835 laminates.