Curamik CoolPerformance Plus liquid-cooled material dissipates large amounts of heat for thermal management of high-power laser diodes and other heat-generating optical devices. Features several layers of pure copper, taking advantage of its thermal conductivity, formed into hermetic, 3-D microchannel or macrochannel water-cooled structures capable dissipating large amounts of heat in small areas. Feature aluminum-nitride (AlN) isolation layers that separate cooling water channels from electrical contacts of laser diodes, and provide a close match in CTE (in the range of 5 to 7ppm/K) between the copper cooling structures and high-power ceramic laser diode packages for improved reliability even at high power levels.
Valor Internet of Things (IoT) Manufacturing hardware device has embedded software for live data collection from all shop-floor machines and processes, leveraging the new Open Manufacturing Language (OML) communication standard. Enables seamless implementation of advanced practices such as Industry 4.0 and Smart Factory, with plug-and-play deployment and minimal change to the manufacturing environment and work processes. Utilizes built-in interfaces to acquire and normalize data from entire manufacturing flow, including surface mount technology (SMT), screen printers, reflow ovens, inspection and test machines, as well as manual operations such as system assembly, test and repair. Provides a simple, standard way of controlling machines and manufacturing flows through the use of OML. Accelerates deployment of shop-floor IT projects by connecting with any MES, ERP, supply chain, PLM and other enterprise applications. Is highly scalability and allows parallel real-time flow of huge data volumes, eliminating potential networking and connectivity issues. Rugged construction for high data integrity and security, including power back-up and fail-safe data management.
ELPEPCB SD 2201 adhesive layer for lamination processes is said to show electrical and mechanical properties such as a high dielectric strength and good adhesion to many base materials. Is a clear-transparent two-pack screen printing ink based on epoxy resin. After it has dried, a carrier material such as copper foil can be laminated under pressure. Via a final cure between 110°C and 150°C, achieves good peel strength of the laminated copper.
Cadence OrbitIO Interconnect Designer, System-in-Package (SiP) Layout and Physical Verification System (PVS) are now included in an IC packaging design and analysis suite, enabling multi-substrate interconnect pathway design, refinement, implementation and manufacturing verification and signoff spanning die I/O pad rings through IC package to system PCB. For advanced Fan-Out Wafer-Level Chip Scale Packaging (WLCSP) and 2.5D interposer-based designs, the new capabilities are said to enable faster multichip integration for smaller, lighter and power-optimized wireless mobile devices. Orbit Interconnect Designer enhancements strengthen 2.5D interposer package design support, providing optimal multi-die, single package interconnect integration. Enables higher performance for multi-substrate integrated devices with minimal size optimized for signal performance.
Interra FL is a copper-clad no-glass laminate for rigid fine-line applications. Is a polyimide film laminated on both sides with low-profile electrodeposited copper for use in multilayer rigid circuit boards. Is suitable for HDI applications. Is compatible with standard PWB processing of thin copper clad laminates. Has a dielectric thickness of 2µm, dielectric constant of <3.5, and low loss tangent of <0.003.
LPKF Debuts ProtoMat E34 compact circuit board plotter has a spindle speed of 30,000 rpm, with a chuck with a micrometer screw gauge for precise height adjustment available to speed up tool change. Resolution of less than 1μm, repeatability of +/-5μm, and registration hole system precision of +/-20μm. Meets requirements for single- or double-sided PCBs. Performs structuring, drilling, and milling. Comes with CircuitPro CAM software, with broad access to all process parameters.
