Smart Parts Search intelligent parts data analysis and verification technology for PCB design powers new tools for seamlessly transforming design intent into realizable design. Helps produce error-free and sourceable bill of materials, complete parts data, and organized parts libraries. Accesses historical lifecycle data, real-time pricing and availability data, and verified alternatives for millions of components in the Ciiva parts database. Smart Parts Analysis streamlines supply-chain sourcing with advanced BoM validation technology that analyses every part in a design to confirm correct part numbers, availability, and pricing. Smart Parts Management automates daily parts management by automatically completing parametric data on components and keeping libraries organized and updated.

Ciiva, ciiva.com

OptimEy automatically co-optimizes SerDes TX and RX equalization to maximize margin for high-speed serial channels. Replaces traditional "blind sweeps" with an automated process that runs quickly enough to generate custom equalization settings for each individual channel in a large system with thousands of links.

SiSoft, www.sisoft.com

Chip-Package-System design flow reportedly has excellent simulation capacity and speed for power integrity, signal integrity and EMI analysis. Automated thermal analysis and integrated structural analysis capabilities provide coupled chip-aware and system-aware simulation for CPS design, enabling end-to-end multi-physics analysis.

Ansys, www.ansys.com

fastRise EZp is a low-temperature curing, low loss flexible bondply for complex rigid/flex PWBs containing polyimide, LCP or PTFE cores. Bonds well to substrates and can be sequentially laminated. Reportedly bonds better to copper than other RF prepregs and yields higher peel in foil laminations.

Taconic, www.taconic.com