Polyonics adhesive transfer tapes include double liners for ease of handling and die cutting, provide high bond strengths, are chemical-resistant and reportedly ideal for use in high-temperature and harsh environment applications.

Talon 3 electroless palladium allows plating directly onto copper. Paves the way for electroless palladium/ immersion gold (EPIG).

Deutsch 369 series connectors include two new versions enabling integration directly to printed circuit boards.

PCB Clustering for OrCAD provides AutoClustering technology, intelligent design (IP) reuse and replication technology that can reduce board placement time.