Imagecure XV501T DI photoimageable solder mask is for laser direct imaging (LDI) and direct imaging (DI). Is a liquid product that dries via evaporation to provide a film that can be sensitized by laser, laser diode, LED, or UVDI exposure. Has resolution capabilities of 50μm (2mm) or less, exposure sensitivity of 80-200 mJ/cm², resistance to HASL processing, and compatibility with a range of nickel/gold and immersion tin chemistries. Reportedly provides excellent adhesion to and encapsulation of copper traces, is halogen-free, and compliant with RoHS and WEEE.

Sun Chemical, www.sunchemical.com

Ersa CAD 4-assistant now integrates PCB-Investigator CAD/CAM system to facilitate selective wave soldering processes.

Autodesk Eagle schematic, PCB and collaboration software features a new routing engine, precise selection, and easy circuitry reuse.

IX Series I/O connector combines high reliability and enhanced EMI/ESD shielding with high-speed transmission capability of 3Gbps. Supports CAT5 cabling and reportedly offers space-savings for factory automation controllers, programmable logic controllers, servo amps, servers, and robotics. Is available in a right angle or straight version with max dimensions of 22.9 x 8.4 x 14.3mm. Receptacles can be mounted in parallel with a pitch distance of 10mm. Includes a positive metal lock with a preload spring mechanism.  Receptacle shell is mounted on the PCB via through-hole solder legs. Wire-termination unit and cable clamp are integrated into a single plug shell. Has rated current of 0.5A (all pins), 1A (any 2 pins), 2A (pin No. 1 and No. 8 only). With an operating temperature range of -40°C to +80°C, connector has a rated voltage of 30V AC.

Hirose
www.hirose.com