Printed Circuit Design & Fab Online Magazine - New Products

New Products

ST-Line solder mask and dry-film pretreatment process equipment is fully compatible with CupraEtch pretreatment chemistry and reportedly boosts yields to control production costs.

Fluke software integrates high-resolution thermal data from TiX580, TiX560, TiX1000, TiX660, TiX640 and TiX620 infrared cameras with National Instruments' LabVIEW and MathWorks' MATLAB software, making it easy to add high-resolution IR data, video and images to R&D analysis and reporting. Allows continuous download of pixel-by-pixel, high-resolution radiometric data. Thermally captures video and ports video data frame-by-frame into MATLAB or LabVIEW software, and monitors it over time, identifying very small temperature changes.

Fluke software for MATLAB, fluke.com/TIMATLAB

Fluke software for LabVIEW, fluke.com/TILABVIEW

N200 punch separates round and odd-shaped panels without dust. Is a top-down air-operated punch for singulating tab-routed PCB panels one tab at a time.

Revision 2016.11 permits inclusion of CAD netlist to Gerber files. New X2 attributes include CAD netlists in Gerber fabrication data; ability to attach component reference designator, pin number and net name to the component pads in outer copper layers; attach netlist name to any conducting object on any copper layer; and attach component reference to any object.

Ucamco, www.ucamco.com

MacuSpec HT 360 is a direct current acid copper plating process. Reportedly offers excellent microdistribution at high current densities. Provides throwing powers of greater than 80% at current densities up to 30 ASF in through holes with aspect ratios of 8:1. Deposits reportedly exceed IPC Class 3A tensile strength and elongation requirements; pass all thermal reliability testing. Components are analyzable by CVS.

MacDermid Enthone, http://www.macdermid.com/companies/macdermid-enthone-electronics-solutions/