Neoganth E Reducer for horizontal applications offers enhanced process stability and safety, and reduces chemistry consumption by up to 25%, lowering operating costs.
WLAN Test Toolkit 17.0, combined with NI Vector Signal Transceiver (VST), supports Draft 1.1 of IEEE 802.11ax waveform generation and analysis for characterization, validation and production test of products, such as RF front end components, wireless modules and user devices.
Affinity ENIG 2.0 is a high-reliability, low-variation electroless nickel immersion gold plating process.
FLIR ETS320 is designed for real-time benchtop viewing, testing and analyzing of thermal characteristics of electronic components and printed circuit boards.
Polyonics adhesive transfer tapes include double liners for ease of handling and die cutting, provide high bond strengths, are chemical-resistant and reportedly ideal for use in high-temperature and harsh environment applications.
Talon 3 electroless palladium allows plating directly onto copper. Paves the way for electroless palladium/ immersion gold (EPIG).