Printed Circuit Design & Fab Online Magazine - New Products

Material Selection for High-Speed PCBs
Consider return loss and insertion loss – but don’t stop there. READ MORE...
Characterizing Etchback and Dielectric Loss Tangent
Fabrication-aware simulations to aid PCB design success. READ MORE...
Sequential Lamination in PCB Manufacturing
Manufacturing high-layer count boards. READ MORE...
Implementing Flash Memory in PCB Design
Routing flash has EMI implications. READ MORE...

New Products

M-Ply prepreg is for radio frequency/digital hybrid bonding.

TechniPad 7611 electroless process deposits pure palladium on electroless nickel.

PDR IR-E3M micro component/PCB rework system is for extreme micro-rework applications.

B-730, B-731 and B-421 laser markable materials complement Ultratemp labels specifically designed for printed circuit board and electronic component applications.

Integr8tor v2017.05 data entry and design analysis tool for sales, pre-CAM and engineering supports PCB surface finishing and its derived benefits.

P4SP series 0.4mm pitch board-to-board / board-to-flexible printed circuit board connector has a current rating of up to 5A, for power supply applications.

New Products

Park Electrochemical Introduces M-Ply Prepreg

Technic Releases TechniPad 7611 ENEPIG

PDR Americas Offers PDR IR-E3M Micro Component/PCB Rework System

Brady Launches B-730, B-731, B-421 Laser Markable Materials

Ucamco Releases Integr8tor v2017.05

Panasonic Debuts P4SP Series 0.4mm Board-to-Board Connectors

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