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  • Material Selection for High-Speed PCBs

    Material Selection for High-Speed PCBs

    Consider return loss and insertion loss – but don’t stop there.  READ MORE...

  • Characterizing Etchback and Dielectric Loss Tangent

    Characterizing Etchback and Dielectric Loss Tangent

    Fabrication-aware simulations to aid PCB design success.  READ MORE...

  • Sequential Lamination in PCB Manufacturing

    Sequential Lamination in PCB Manufacturing

    Manufacturing high-layer count boards.  READ MORE...

  • Implementing Flash Memory in PCB Design

    Implementing Flash Memory in PCB Design

    Routing flash has EMI implications.   READ MORE...

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  • New Products

New Products

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BondFilm LDD MSAP low-temperature pretreatment process prepares circuit board surfaces for laser direct drilling at a etch depth of 0.5µm.

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CircuitShield anti-corrosion and waterproofing coating contains a novel chemical plasma coating that replaces traditional encapsulants and coatings.

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Valor NPI software provides an automated printed circuit board design-for-manufacturing (DFM) flow.

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FH64MA series compact flexible printed circuit (FPC) connector offers a profile of 0.5mm with 0.25mm pitch and depth of 3.15mm when locked.

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Searay high-speed, high-density connectors come in 1.27 X 1.27mm open pin field grid array, with no pins dedicated as signal or ground.

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Meteorwave 3350 copper-clad laminate is for radio frequency applications requiring a tightly controlled 3.5 Dk.

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