InCAM 3.03 focuses on yield improvement for multilayer boards.

Offers faster flex panelization, easier data manipulation after advanced etch compensation, and improved impedance line recognition - opening up new possibilities for global trace editing on the layer. New features include accurate etch compensation, easier trace manipulation and editing; improved impedance line recognition for expanded multi-trace editing capabilities; automatic strip shape creation for flex boards; and improved flex board checks and tooling hole checks.

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