N4000-6NF (“no flow”) high-Tg epoxy prepreg system is for bonding flex circuitry and bonding heat sinks to rigid circuit boards.

Is said to adhere well to most substrates. Minimal and consistent flow is controlled through precise rheological and prepreg process control. Is based N4000-6 resin system.

Park Electrochemical / Nelco / Neltec


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