VT-5A2 high Tg laminate and prepreg material has a thermal conductivity eight times that of FR-4.
Comes in thin core and prepreg variants. Features a thermal conductivity of 2.2 W/m.K, Tg of 190°C, thermal performance of T260 >60 min. / T288 >30 min. / T300 >15 min., and M.O.T. up to 150°C. Is lead-free assembly compatible, fulfills RoHS and WEEE requirements and complies with UL94 V0. Polymer matrix is fully compatible with Ventec laminates, epoxy or polyimide-based materials including tec-speed. Is for power converters, hybrid multilayers and high power electronics with heavy copper designs providing enhanced signal stability in harsh environments.
Ventec International