FloTHERM XT electronics cooling software has advanced thermal management capabilities.

New features include simulation of spinning parts in electronic enclosures; temperature-dependent power simulation; enhanced design of experiments parametric studies functionality to determine best design coverage; and thermal territory simulation when using various component materials. Can be used at all stages of electronic design process. Enhancements to user interface make it easier to set model parameters and find mesh controls for improved thermal design predictability. Two approaches are available for tool interoperability; files can be directly imported through the FloEDA Bridge module; the second approach uses a neutral file format, allowing the user to interact with the setup of a model outside of the standard interface.

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