Cadence OrbitIO Interconnect Designer, System-in-Package (SiP) Layout and Physical Verification System (PVS) are now included in an IC packaging design and analysis suite, enabling multi-substrate interconnect pathway design, refinement, implementation and manufacturing verification and signoff spanning die I/O pad rings through IC package to system PCB. For advanced Fan-Out Wafer-Level Chip Scale Packaging (WLCSP) and 2.5D interposer-based designs, the new capabilities are said to enable faster multichip integration for smaller, lighter and power-optimized wireless mobile devices. Orbit Interconnect Designer enhancements strengthen 2.5D interposer package design support, providing optimal multi-die, single package interconnect integration. Enables higher performance for multi-substrate integrated devices with minimal size optimized for signal performance.

Cadence Design Systems, cadence.com/news/ICpackaging172

Interra FL is a copper-clad no-glass laminate for rigid fine-line applications. Is a polyimide film laminated on both sides with low-profile electrodeposited copper for use in multilayer rigid circuit boards. Is suitable for HDI applications. Is compatible with standard PWB processing of thin copper clad laminates. Has a dielectric thickness of 2µm, dielectric constant of <3.5, and low loss tangent of <0.003.

DuPont, www.dupont.com

LPKF Debuts ProtoMat E34 compact circuit board plotter has a spindle speed of 30,000 rpm, with a chuck with a micrometer screw gauge for precise height adjustment available to speed up tool change. Resolution of less than 1μm, repeatability of +/-5μm, and registration hole system precision of +/-20μm. Meets requirements for single- or double-sided PCBs. Performs structuring, drilling, and milling. Comes with CircuitPro CAM software, with broad access to all process parameters.

LPKF, lpkf.com

Sun Chemical Introduces EMD5800 nanosilver conductive ink is for printed RFID, OLED panels, thin-film photovoltaic designs, printed antennae, and touch screen displays. Inkjet-printable. Features high conductivity and print resolution, jetting performance, monodispersion, and low-temperature sintering. Can be used on a variety of substrates, including polyimide, PET, PC and PC/ABS, and is compatible with most industrial and commercial printheads.

Sun Chemical Electronic Materials, sunchemical.com