Microwave Impedance Calculator now includes additional dielectric materials, thermal model capabilities, and bug fixes. Software is intended to assist with microwave circuit design in predicting the impedance of a circuit made with high-frequency circuit materials. Has capability to predict transmission line losses. Determines predicted impedance and other electrical information.  Uses closed form equations to determine impedance and loss. Loss calculation is divided into conductor loss and dielectric loss. Also predicts wavelength, skin depth and thermal rise above ambient.

Rogers Corp., www.rogerscorp.com

Three Wavelength series Ledia direct imaging (DI) systems are for high-speed exposure of solder mask and innerlayer and outer-layer resists. These five and six exposure head systems combine 365, 385 and 405nm wavelength LED emissions. Reportedly deliver 15µm lines and spaces with well-defined edges, with improvements in throughput.

Ucamco, www.ucamco.com

PE827 and PE828 electronic inks cure at as low as 60°C. Potential applications include printed antennas, sensor applications, heated surfaces and smart packaging applications. Viable substrate options for printed electronics include PVC, polystyrene, high-density polyethylene, and acrylic polymers.

DuPont, www.dupont.com

VisualCAM Stencils v. 16.7 design tool streamlines and automates stencil/paste designs generation. New release defines paste shapes using pitch rules. Features enhanced library management, improved identification and shape assignments, and improved paste generation and reporting. Includes many new macro commands and a powerful macro developer to aid in automation, data preparation and stencil generation.

Wise Software Solutions, wssi.com

Register now for PCB West, the Silicon Valley's largest trade show for printed circuit board design, fabrication and assembly: Sept. 15-17 at the Santa Clara Convention Center pcbwest.com