92ML thermally enhanced epoxy-based laminates and prepregs are for high-power applications. Are halogen-free, flame retardant, and thermally conductive. For multilayer applications requiring thermal management throughout the entire board. Come with up to 4oz. copper cladding. Thermal conductivity of up to 3.5 W/mK (in-plane); Tg of 160°C; Z-axis coefficient of thermal expansion of 22ppm/°C (<Tg) and 175ppm/C (>Tg), for lead-free solder exposure and board reliability testing. High degree of resin flow. In combination with an aluminum plate, will form an insulated metal substrate (92ML StaCool)

Rogers Corp., rogerscorp.com

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