DFM Now! Pro software analyzes Gerber, ODB++, and NC drill files. Can edit and save Gerber date, perform DXF import/export, pinpoint DFM errors, and use SMT stencil tools, along with additional CAM features. Includes intelligent object drag and merge and panelize features. DXF importer can construct filled Gerber polygons and handle text fonts such as TrueType and SHX. Supports AutoCAD DWG files. Can load multiple ODB++ files simultaneously. Is offered for Windows and Linux operating systems.

Numerical Innovations, www.numericalinnovations.com

Thru-Cup MSC-PS acid cleaner is for cleaning and increased wetting of high aspect ratio plated through-holes and microvias. Reportedly has superior detergency and low surface tension that provides for electroplated copper adhesion and void-free coverage. Is designed as a drop-in replacement process for vertical copper electroplating applications. Has minimal copper etching and does not attack or damage dry film resists.

Uyemura USA, www.uyemura.com

85HP high-performance polyimide laminate and prepreg material has a Tg of 250°C. Is based on 85N polyimide resin. Uses spread glass styles and a micro-fine filler system. Reportedly offers 2x thermal conductivity vs. other polyimide resin systems. Is ideal for use in high-temperature applications such as burn-in semiconductor testing and down-hole drilling. Use of spread glass reinforcements with a filled polyimide resin system results in laminates with X-Y CTE values close to that of copper (16-18 ppm/°C) and a low Z-axis expansion.

Arlon Electronic Materials, www.arlon-med.com

NTwC (New Transport with Clamping) Electro Plater provides automatic, contact-free, horizontal transport of printed circuit boards mounted in clamping frames. Can be used for flash plating, panel plating, pattern plating, via filling, SAP and mSAP. PCBs with high aspect ratio (> 20:1) and substrates down to 25µm can be processed. Also works with boards up to 3.2mm.

Schmid Group, www.schmid-group.com